Facility & Equipment Details
Description
The Zeiss Xradia 620 Versa is a submicron-resolution 3D X-ray imaging system for non-destructive inspection of samples. It can perform both linear and volumetric measurements, as well as dimensional analysis of TSVs and microbumps, solder volumes and shapes, bond line thicknesses and die warpage, 3D void analysis, and other measurements of interest with minimal need for sample preparation.
By leveraging the Zeiss Resolution at a Distance (RaaD) technology, the Xradia Versa maintains a high resolution across large working distances, accommodating large samples without sacrificing resolution.
System Capabilities:
High power (25 W) X-ray source with energy range of 30 – 160 keV
High spatial resolution (~500 nm) with two-stage magnification
Insertable flat panel detector for high throughput measurements
Fully automatic control (filters, detectors, objectives) and reconstruction
Can accommodate a wide array of sample sizes and materials
By leveraging the Zeiss Resolution at a Distance (RaaD) technology, the Xradia Versa maintains a high resolution across large working distances, accommodating large samples without sacrificing resolution.
System Capabilities:
High power (25 W) X-ray source with energy range of 30 – 160 keV
High spatial resolution (~500 nm) with two-stage magnification
Insertable flat panel detector for high throughput measurements
Fully automatic control (filters, detectors, objectives) and reconstruction
Can accommodate a wide array of sample sizes and materials
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