Grants & Projects per year
Personal profile
Research interests
- Heat transfer
- Electronics packaging
- Thermal management of data centers
- Heterogeneous integration research
Biography
Bahgat Sammakia is a SUNY Distinguished Professor of Mechanical Engineering at Binghamton University. He is also the founding director of S3IP, a New York State Center of Excellence at Binghamton, and the director of the NSF I/UCRC for Energy-Smart Electronic Systems (ES2).
His research covers several broad areas, including energy optimization in data centers, electronics systems integration and packaging, flexible electronics, and thermal management of electronic devices and systems.
Sammakia is a fellow of the American Society of Mechanical Engineers, the National Academy of Inventors and the IEEE. He also is a recipient of the SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities. He was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management as well as the ASME Heat Transfer Memorial Award in 2020.
Resources
Education/Academic qualification
Bachelor, University of Alexandria
Master, University at Buffalo
PhD, University at Buffalo
Postdoctoral Fellow, University of Pennsylvania
ASJC Scopus Subject Areas
- Mechanical Engineering
Researcher Selected Keywords
- Heat transfer
- Electronics packaging
- Thermal management of data centers
- Heterogeneous integration research
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Collaborations and top research areas from the last five years
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STCO: Thermal Management: Direct-to-Chip and Embedded Liquid Cooling Architectures
Sammakia, B. (PI) & Rangarajan, S. (CoPI)
Semiconductor Research Corporation
06/1/26 → 05/31/27
Project: Research
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Honeywell Material Testing and Analysis of Sensors Phases 1-4
Sammakia, B. (CoPI), Rangarajan, S. (CoI) & Rangarajan, S. (PI)
Honeywell International Incorporated
04/22/26 → 04/21/27
Project: Research
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SCALE: A Microelectronic Workforce Development Production Project-PHASE II (YR 4) PTE: W52P1J--22-9-3009
Sammakia, B. (PI), Park, S. (CoPI) & Rangarajan, S. (CoPI)
04/1/26 → 03/31/27
Project: Research
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HIAP Scholarships: SCALE: A Microelectronic Workforce Development Production Project AMD 4
Sammakia, B. (PI) & Rangarajan, S. (CoPI)
04/1/26 → 03/31/27
Project: Research
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Green Refrigerant Compact Hybrid System for Ultra-Efficient and Sustainable HPC Cooling
Sammakia, B. (PI) & Rangarajan, S. (CoPI)
Advanced Research Projects Agency - Energy
03/10/25 → 03/9/28
Project: Research
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A Novel Vision-Based Framework for Detecting Changes in Heat Flux in Pool Boiling Using Morphological Similarity
Nirapure, P., Singh, A., Rangarajan, S. & Sammakia, B. G., Dec 1 2026, In: Journal of Electronic Packaging. 148, 4, 040907.Research output: Contribution to journal › Article › peer-review
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Demonstration of Two-Phase Jet Impingement Cooling with Phase Separation Membrane using Water on High-Power AI GPU
Yang, Y., Rajeev, S., Lattupalli, H. K., Yogi, K., Rangarajan, S., Sammakia, B. & Wei, T., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers Inc., p. 1694-1700 7 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
Yogi, K., Sahu, G., Rajeev, S., Lattupalli, H. K., Wang, K., Chen, Z., Yang, Y., Schiffres, S., Rangarajan, S., Sammakia, B., Weibel, J. A. & Wei, T., Jun 1 2026, In: Journal of Electronic Packaging. 148, 2, 020904.Research output: Contribution to journal › Article › peer-review
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Experimental Evaluation of Flow Restrictors for Mitigating Instabilities in Rack-Level Two-Phase D2C Cooling Systems
Heydari, A., Al-Zu'Bi, O., Manaserh, Y., Gharaibeh, A. R., Altubeshat, A., Mehrabikermani, M. & Sammakia, B., 2026, 42nd Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2026 - Proceedings 2026. Institute of Electrical and Electronics Engineers Inc., p. 116-120 5 p. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Integrating Liquid-to-Air Sidecars in High-Power Data Centers: Challenges and Best Practices
Radmard, V., Hosseini, F., Heydari, A., Tradat, M., Karajgikar, S., Kalma, D. & Sammakia, B., Dec 1 2026, In: Journal of Electronic Packaging. 148, 4, 040906.Research output: Contribution to journal › Article › peer-review