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Dive into the research topics where Benson Chan is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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84.116Z Cleanroom Equipment for Electronics Manufacturing Workforce Development
Chan, B. (PI) & Brady, V. (CoPI)
09/1/24 → 08/31/27
Project: Research
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Surface Mount Technology Line (SMT) - Low Volume/High Mix
Chan, B. (PI)
10/17/22 → 10/16/23
Project: Research
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FROM THE GENERAL CHAIR
Chan, B., 2025, In: Advancing Microelectronics. 52, 4, p. 4 1 p.Research output: Contribution to journal › Editorial
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Digital Twins for IC Packages and Electronics-enabled Systems
Inamdar, A., Gromala, P., Bailey, C., Nguyen, L., Chan, B., Ryu, J., Rezaie, F., Detofsky, A., Van Driel, W. D. & Zhang, G. Q., 2024, Proceedings - 2024 IEEE Smart World Congress, SWC 2024 - 2024 IEEE Ubiquitous Intelligence and Computing, Autonomous and Trusted Computing, Digital Twin, Metaverse, Privacy Computing and Data Security, Scalable Computing and Communications. Institute of Electrical and Electronics Engineers Inc., p. 2125-2132 8 p. (Proceedings - 2024 IEEE Smart World Congress, SWC 2024 - 2024 IEEE Ubiquitous Intelligence and Computing, Autonomous and Trusted Computing, Digital Twin, Metaverse, Privacy Computing and Data Security, Scalable Computing and Communications).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Development of Next Generation Stretchable Materials for Flexible Hybrid Electronics (FHE)
Manian Ramkumar, S., Stemmermann, A., Rajan, B. M., Quelhas, I., Alhendi, M., Poliks, M., Abbara, E. M., Chan, B., Ogiwara, T., Saki, N., Otomo, M. & Araujo, K., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 829-834 6 p. 9159392. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
11 Scopus citations -
Combining computational fluid dynamics (CFD) and flow network modeling (FNM) for design of a multi-chip module (MCM) cold plate
Fernandes, J., Ghalambor, S., Docca, A., Aldham, C., Agonafer, D., Chenelly, E., Chan, B. & Ellsworth, M., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 2).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3 Scopus citations -
Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
Doany, F. E., Schow, C. L., Lee, B. G., Budd, R. A., Baks, C. W., Tsang, C. K., Knickerbocker, J. U., Dangel, R., Chan, B., Lin, H., Carver, C., Huang, J., Berry, J., Bajkowski, D., Libsch, F. & Kash, J. A., 2012, In: Journal of Lightwave Technology. 30, 4, p. 560-571 12 p., 6086698.Research output: Contribution to journal › Article › peer-review
101 Scopus citations