Grants & Projects per year
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Dive into the research topics where Christopher Borst is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
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Screen Advanced Technology Center of America LLC Operating Agreement
Borst, C. (PI)
SCREEN Advanced Technology Center of America Limited Liability Company
04/6/26 → 03/31/36
Project: Research
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Applied Materials- Research Facility Agreement
Borst, C. (PI), Iacoponi, J. (PI) & Liehr, M. (PI)
11/1/18 → 11/1/32
Project: Research
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Applied Materials Capital Corp
Borst, C. (PI), Iacoponi, J. (PI) & Liehr, M. (PI)
07/1/18 → 12/31/27
Project: Research
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NYS- IBM AI Hardware Center
Borst, C. (PI), Shahedipour-Sandvik, S. (CoI), Head, S. (CoI), Iacabucci, J. (CoI), Kaplan, K. (CoI) & Kelly, P. (CoI)
04/1/18 → 12/31/28
NY Creates, University at Albany
Project: Research
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Materials and processes for superconducting qubits and superconducting electronic circuits on 300mm wafers
Papa Rao, S. S., Hobbs, C., Olson, S., Foroozani, N., Chong, H., Stamper, H., Martinick, B., Ashworth, D., Bunday, B., Malloy, M., Holland, E., Nalaskowski, J., Kearney, P., Ngai, T., Wells, I., Yakimov, M., Oktyabrsky, S., O'Brien, B., Kaushik, V. & Dunn, K. A. & 9 others, , 2018, ECS Transactions. Roozeboom, F., Timans, P. J., Kakushima, K., Jagannathan, H., Karim, Z., Gusev, E. P. & De Gendt, S. (eds.). 6 ed. Electrochemical Society Inc., p. 151-161 11 p. (ECS Transactions; vol. 85, no. 6).NY Creates, University at Albany
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
5 Scopus citations -
Effect of Ion Flux in Source-Drain Extension Ion Implantation for 10-nm Node FinFet and beyond on 300/450mm Platforms
Shen, M. Y., Basavalingappa, A., Borst, C., Hayakawa, T., Matsugi, H. & Chang, S., Mar 20 2017, 2016 21st International Conference on Ion Implantation Technology, IIT 2016. Institute of Electrical and Electronics Engineers Inc., 7882867. (Proceedings of the International Conference on Ion Implantation Technology).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
450mm Cu single damascene BEOL process with 20nm half-pitched features
Sunoo, K., Dunn, S., Smith, S., Collision, W., Prudhomme, J., Wang, H. M., Maniscalco, J., Yathapu, N., Song, C., Wang, B., Carr, C., Liu, H. W., Gall, B., Alaestante, A., Chen, M. H., Conti, R., Chungju, Y., Sullivan, D., Culafi, K. & Bumki, M. & 24 others, , Jul 8 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 8-10 3 p. 7507638. (2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Estimation of number of PGV for a 450mm fab: FA: Factory automation
Huang, C. W. & Borst, C. L., Jun 13 2016, 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 164-167 4 p. 7491117. (2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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STI 28nm pitch guided DSA to enable the 450mm tools qualification and transition
Larrea, A. S., Dunn, S., Collison, W., França, D., Borst, C., Lee, J., Lim, J. H. J. H. & Chang, S., Jun 13 2016, 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 237-242 6 p. 7491134. (2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review