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Collaborations and top research areas from the last five years
Grants & Projects
- 15 Finished
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Advanced Electronics Manufacturing Issues SUNY ME Funding for Vibration and FEA - Agreement 13072572
Pitarresi, J. (PI) & Su, Q. (CoPI)
Universal Instruments Corporation
01/1/13 → 08/31/13
Project: Research
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Drop Testing of Lead Free Assemblies: Energy Correlaton Studies Part IV
Pitarresi, J. (PI)
Universal Instruments Corporation
01/1/09 → 05/31/09
Project: Research
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Energy Correlation Studies: Part III
Pitarresi, J. (PI)
Universal Instruments Corporation
09/1/08 → 12/31/08
Project: Research
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Drop Testing of Lead Free Assemblies: Energy Correlation Studies (Part 2)
Pitarresi, J. (PI)
Universal Instruments Corporation
05/16/08 → 08/31/08
Project: Research
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Energy Correlation Studies
Pitarresi, J. (PI)
Universal Instruments Corporation
05/16/08 → 08/31/09
Project: Research
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Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
Gharaibeh, M. A. & Pitarresi, J. M., Jun 1 2025, In: Journal of Electronic Packaging. 147, 2, 021001.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
MOTIVES AND TACTICS: REPRESENTATIONS OF ASPIRATIONAL CAPITAL AMONG MARGINALIZED-IDENTITY STEM STUDENTS
Sausner, E. B. & Pitarresi, J. M., 2025, In: Journal of Women and Minorities in Science and Engineering. 31, 2, p. 79-101 23 p.Research output: Contribution to journal › Article › peer-review
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“I know what I need to learn”: The intersection of aspirational and navigational capitals for marginalized-identity STEM students
Sausner, E. B., Wentzel, C. & Pitarresi, J., Apr 2024, In: Journal of Engineering Education. 113, 2, p. 488-508 21 p.Research output: Contribution to journal › Article › peer-review
Open Access4 Scopus citations -
An efficient equivalent static methodology for simulating electronic packages subjected to resonant vibrations
Gharaibeh, M. A. & Pitarresi, J. M., Jun 2023, In: Microelectronics Reliability. 145, 115000.Research output: Contribution to journal › Article › peer-review
Open Access6 Scopus citations -
Drop and impact reliability investigation of BGA and LGA interconnects
Gharaibeh, M. A. & Pitarresi, J. M., Jun 30 2023, In: Soldering and Surface Mount Technology. 35, 4, p. 244-254 11 p.Research output: Contribution to journal › Article › peer-review
12 Scopus citations