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Collaborations and top research areas from the last five years
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Center of Excellence in Nanoelectronics and Nanotechnology 2025-2030
Fancher, M. (PI), Geer, R. (CoI) & Oktyabrsky, S. (CoI)
NYS Department of Economic Development
07/1/25 → 06/30/26
University at Albany, NY Creates
Project: Research
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Northeast Consortia for Advanced Integrated Silicon Technologies
Michelen, A. (PI) & Geer, R. (CoI)
09/1/23 → 08/31/26
SUNY Polytechnic Institute, University at Albany
Project: Research
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FMSG: Bio-Manufacturing of Hybrid Tissue-Electronic and Photonic Devices
Sharfstein, S. (PI), Cady, N. (CoPI), Geer, R. (CoPI) & Xie, Y. (CoPI)
01/1/24 → 08/31/25
Project: Research
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ATE - Regional Center for Semiconductor & Nanotechnology Education
Geer, R. (PI) & Michelen, A. (CoPI)
01/1/24 → 10/31/25
Project: Research
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Design-Centric Education and Workforce Development - Utilizing an Open-Source Academic PDK for Photonic Integrated Circuit Design Courses
Geer, R. E. & Preble, S., Sep 18 2025, Optical Design Automation. Heinz-Garcia, J. & Gregory, G. (eds.). SPIE, 136010L. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 13601).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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VR simulation and digital twin based training for workforce development in integrated photonics
Saini, S., Fay, I., Morrisey, T., Krambeck, J., Gupta, A., Hall, M., Agarwal, A., O’Brien, P., Gradkowski, K., Wagner, M., Pennington, G., Gardner, J., Striemer, C., Geer, R., Unger, E. A., Norris, G. A., Kirchain, R. & Kimerling, L. C., Sep 18 2025, Optical Design Automation. Heinz-Garcia, J. & Gregory, G. (eds.). SPIE, 136010K. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 13601).NY Creates, University at Albany
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Generalized surface morphology model for Si photonic waveguide simulation
Agbodo, N. D. & Geer, R., Sep 1 2021, In: Optical Engineering. 60, 9, 097104.Research output: Contribution to journal › Article › peer-review
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Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) with through Silicon Via and Copper Pillar Bonding Approach
Choobineh, L., Carrol, R., Gutierrez, C. & Geer, R., Sep 1 2020, In: Journal of Electronic Packaging. 142, 3, 031106.Research output: Contribution to journal › Article › peer-review
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Collective Cu-Cu thermocompression bonding using pillars
Carroll, R., La Tulipe, D., Coolbaugh, D. & Geer, R., Jan 2019, In: Journal of Microelectronics and Electronic Packaging. 16, 1, p. 28-38 11 p.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations