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Dive into the research topics where Saad Hamasha is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Effect of Bismuth Addition to SAC305 on the Microstructure and Mechanical Properties of Solder Joints
Hamasha, K., Hamasha, M. M. & Hamasha, S., Mar 1 2026, In: Journal of Electronic Packaging. 148, 1, 011012.Research output: Contribution to journal › Article › peer-review
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Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages
Qasaimeh, Q., Liu, J., Silva, D. F., Qasaimeh, A., Evans, J. L. & Hamasha, S., Feb 2026, In: Journal of Intelligent Manufacturing. 37, 2, p. 659-677 19 p.Research output: Contribution to journal › Article › peer-review
Open Access5 Scopus citations -
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish
Alakayleh, A., Hamasha, S., Daradkeh, S., Tahat, S., Evans, J. & Alahmer, A., 2026, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 16, 2, p. 291-306 16 p.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
A Machine Learning Framework with Shapley’s Additive Explanations to Assess Solder Joint Reliability for Electronic Packaging
Qasaimeh, Q., Li, H., Hamasha, S. & Liu, J., Sep 2025, In: Journal of Electronic Materials. 54, 9, p. 7586-7608 23 p.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Analysis of Mechanical and Electrical Responses in Molybdenum Silicide Thin Film Laid on PET During Tension Application
Alkhazali, A., Hamasha, M. M., Hamasha, S., Alkhazali, I. S., Alzoubi, K., Rawashdeh, M. & Massadeh, R., Sep 2025, In: Jordan Journal of Mechanical and Industrial Engineering. 19, 3, p. 571-577 7 p.Research output: Contribution to journal › Article › peer-review
Open Access