Grants & Projects per year
Personal profile
Research interests
- Electronics MEMS packaging
- reliability
- computer aided engineering
Biography
Park started his academic career at Binghamton University in 2002. He has been involved in several projects related to electronics packaging in cooeration with the Integrated Electronics Engineering Center (IEEC), which includes a broad range of industry as members. His expertise in micro/nanomechanics and optomechanics contributes to the center in conducting on-going and prospective projects.
Park began his professional career at IBM Microelectronics Division, where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high performance packaging.
Park served as a panelist for the Yield Learning Conference hosted by IBM Academy of Technology. He spent over six years at the IBM Microelectronics Division in Endicott and East Fishkill, NewYork.
Resources
Education/Academic qualification
Bachelor, Seoul National University
Master, Seoul National University
PhD, Purdue University
ASJC Scopus Subject Areas
- Mechanical Engineering
Researcher Selected Keywords
- MEMS
- reliability
- computer aided engineering
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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SCALE: A Microelectronic Workforce Development Production Project-PHASE II (YR 4) PTE: W52P1J--22-9-3009
Sammakia, B. (PI), Park, S. (CoPI) & Rangarajan, S. (CoPI)
04/1/26 → 03/31/27
Project: Research
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Curtiss-Wright's Participating Membership in the IEEC (2026-2027)
Park, S. (PI)
03/1/26 → 02/28/27
Project: Research
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Daeduck Electronics Full Membership in the IEEC 2026
Park, S. (PI)
Daeduck Electronics Company Limited
01/1/26 → 12/31/26
Project: Research
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Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network
Zhang, Z., Li, Y., Yoon, S. W., Park, S. & Won, D., Jun 2026, In: Microelectronics Reliability. 181, 116125.Research output: Contribution to journal › Article › peer-review
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Enhanced Design of Airborne Radiation Sensor for Improved Survivability During Deployment Impact
Yin, P., Ha, J., Yang, J., Deo, K., Lai, Y. & Park, S., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 7, p. 1410-1416 7 p.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study
Chavan, V. D., Lehenkari, T., Yadav, S., Ustad, R. E., Sheikh, Z. A., Avatare, A. T., Kamble, T. P., Sajjad, L., Komsa, H. P., Sabale, S., Choi, K. K., Park, S., Dastgeer, G., Kim, H. & Kim, D. K., Jun 2025, In: Materials Today Nano. 30, 100631.Research output: Contribution to journal › Article › peer-review
4 Scopus citations -
Influence of Doping on the Electromigration Performance of SAC Solder Alloys on BGA Components
Deo, K. A., Yang, J., Lai, Y., Yang, D. & Park, S. B., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1405-1411 7 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4 Scopus citations -
ReflowNet: ConvLSTM-based direct reflow oven recipe optimization framework
Kataoka, J., Farrag, A., Lai, Y., Park, S., Jin, Y. & Won, D., Dec 2025, In: Journal of Intelligent Manufacturing. 36, 8, p. 5859-5873 15 p.University at Buffalo, Binghamton University
Research output: Contribution to journal › Article › peer-review
5 Scopus citations