Project Details
| Status | Finished |
|---|---|
| Effective start/end date | 01/1/23 → 12/31/25 |
Funding
- Purdue University: $135,000.00
CHIRP-Experimental Characterization of Thermal Shadowing Effect and AI Driven Optimization of Boiling Enhancement Coatings for Singe and Two-Phase Immersion Cooling Subagreement under the Semiconductor Research Corporation Prime Agreement
- Sammakia, Bahgat (PI)
- Rangarajan, Srikanth (CoPI)
- Schiffres, Scott (CoPI)
Project: Research