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Effect of Variation in Processing Parameters of Pb Free Solder Joints on Mechanical Behavior of Solder Bumps in Isothermal Shear Fatique Test - Physics Dept. Research Support - Agreement # 16062577

Binghamton University

Project: Research

Project Details

StatusFinished
Effective start/end date01/1/16 → 06/15/16

Funding

  • Universal Instruments Corporation: $43,500.00