Project Details
| Status | Active |
|---|---|
| Effective start/end date | 07/1/25 → … |
ENG_SEMICON: Manufacturing USA: Plasticity-Induced Cu-Cu Bonding for Scalable 3D Chip Integration in Advanced Semiconductor Packaging
Project: Research
Project: Research
| Status | Active |
|---|---|
| Effective start/end date | 07/1/25 → … |