@inproceedings{b50ffe73cd45479dad500fd68ee9f38e,
title = "A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys",
abstract = "In the literature there has been a number of constitutive models proposed for modeling thermomechanical behavior of Pb/Sn solder alloys. Some of these models are based on the plasticity (using time independent irreversible deformations), and some are based on the viscoplasticity (using time dependent irreversible deformations). In this paper it is demonstrated that Pb/Sn solder alloys are highly viscous materials, and that their behavior cannot accurately be modeled with a plasticity based model.",
author = "Cemal Basaran",
note = "Publisher Copyright: {\textcopyright} 1996 American Society of Mechanical Engineers (ASME). All rights reserved.; ASME 1996 International Mechanical Engineering Congress and Exposition, IMECE 1996 ; Conference date: 17-11-1996 Through 22-11-1996",
year = "1996",
doi = "10.1115/IMECE1996-0729",
language = "English",
series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",
publisher = "American Society of Mechanical Engineers (ASME)",
pages = "149--153",
editor = "Y.W. Kwon and D. Davis and H.H. Chung",
booktitle = "Structural Analysis in Microelectronics and Fiber Optics",
address = "United States",
}