TY - GEN
T1 - A high power density and high efficiency three phase inverter based on a hybrid 3D SiC packaging power module
AU - Liu, Teng
AU - Huang, Zhizhao
AU - Tan, Yifan
AU - Chen, Cai
AU - Zou, Kaifeng
AU - Peng, Han
AU - Kang, Yong
AU - Luo, Fang
N1 - Publisher Copyright: © 2018 IEEE.
PY - 2018/12/3
Y1 - 2018/12/3
N2 - This paper presents the design of a high power density and high efficiency three phase inverter based on a highly integrated 3D SiC packaging power module. Due to the low inductive of the packaging power module, the power module can operate on fast switching speed safely, which will realize a high efficiency. The 3D power module integrating with gate drivers, DC-link, cooling fan and heat-sink increases space utilization to realize a high power density. For a better thermal performance, the diameter and distribution of holes in the heat-sink has been optimized by the simulation. The simulation results show that the 36 holes heat-sink with diameter 5 mm has the best thermal performance, and the 3D heat-sink achieves 37.5% volume reduction and realizes uniform temperature distribution compared with the traditional heat-sink design. Moreover, a 5 kW single phase half-bridge inverter prototype is built to demonstrate the validity of the heat-sink design. Based on the analysis of the simulation and the test, a 20 kW three phase inverter prototype with 18.6 kW/L power density and 99% efficiency can be realized.
AB - This paper presents the design of a high power density and high efficiency three phase inverter based on a highly integrated 3D SiC packaging power module. Due to the low inductive of the packaging power module, the power module can operate on fast switching speed safely, which will realize a high efficiency. The 3D power module integrating with gate drivers, DC-link, cooling fan and heat-sink increases space utilization to realize a high power density. For a better thermal performance, the diameter and distribution of holes in the heat-sink has been optimized by the simulation. The simulation results show that the 36 holes heat-sink with diameter 5 mm has the best thermal performance, and the 3D heat-sink achieves 37.5% volume reduction and realizes uniform temperature distribution compared with the traditional heat-sink design. Moreover, a 5 kW single phase half-bridge inverter prototype is built to demonstrate the validity of the heat-sink design. Based on the analysis of the simulation and the test, a 20 kW three phase inverter prototype with 18.6 kW/L power density and 99% efficiency can be realized.
KW - Flexible printed circuit board
KW - Hybrid packaging structure
KW - SiC phase-leg power module
UR - https://www.scopus.com/pages/publications/85060269675
U2 - 10.1109/ECCE.2018.8558233
DO - 10.1109/ECCE.2018.8558233
M3 - Conference contribution
T3 - 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
SP - 1944
EP - 1948
BT - 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018
Y2 - 23 September 2018 through 27 September 2018
ER -