Abstract
A new self-aligned bipolar structure, which fea- tures a nonrecessed base and a selectively deposited polysilicon emitter, is proposed. The in situ surface cleaning process prior to the selective-polysilicon deposition minimizes the residual native oxide in the emitter window. Both high-quality selective-polysilicon film and well-behaved submicrometer bipolar device characteristics have been obtained for bipolar or BiCMOS VLSI applications. The impacts of the nonrecessed-base device structure on the bipolar device parameter distribution and bipolar hot-carrier immunity have also been discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 1711-1716 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 39 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1992 |
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