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A Novel Flexible Blood Pressure Sensor Based on Ultrathin Silicon for Continuous Monitoring

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Continuous blood pressure (BP) monitoring is essential for the early detection and effective management of cardiovascular diseases. Conventional photoplethysmography (PPG) sensors are limited by their susceptibility to ambient light conditions and a low signal-to-noise ratio, whereas piezoelectric sensors often face challenges in achieving close skin conformity due to their inherent rigidity. This study introduces an innovative flexible BP sensor based on 5 μm ultrathin silicon, designed for continuous monitoring. Encapsulated in Eco-flex 0030 and reinforced with fiberglass, the sensor maintains high sensitivity and precision. Finite element analysis is employed to optimize the encapsulation materials and dimensions. When affixed to the wrist, the sensor proves to be non-burdensome and non-irritating to the skin, effectively detecting radial artery pulses. To estimate blood pressure, reflective pulse transit time (R-PTT) is utilized. Calibration against a standard sphygmomanometer indicates a high degree of concordance between the systolic and diastolic pressures estimated from the collected signals and the actual measured values, thereby validating its reliability for cardiovascular monitoring. The findings suggest that this BP sensor offers a promising improvement in continuous, non-invasive blood pressure monitoring technology.

Original languageEnglish
Title of host publication2024 IEEE Sensors, SENSORS 2024 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350363517
DOIs
StatePublished - 2024
Event2024 IEEE Sensors, SENSORS 2024 - Kobe, Japan
Duration: Oct 20 2024Oct 23 2024

Publication series

NameProceedings of IEEE Sensors

Conference

Conference2024 IEEE Sensors, SENSORS 2024
Country/TerritoryJapan
CityKobe
Period10/20/2410/23/24

Keywords

  • Au-Au direct bonding
  • blood pressure monitoring
  • finite element analysis
  • ultrathin silicon

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