TY - GEN
T1 - A novel low inductive 3D SiC power module based on hybrid packaging and integration method
AU - Huang, Zhizhao
AU - Li, Yuxiong
AU - Chen, Lichuan
AU - Tan, Yifan
AU - Chen, Cai
AU - Kang, Yong
AU - Luo, Fang
N1 - Publisher Copyright: © 2017 IEEE.
PY - 2017/11/3
Y1 - 2017/11/3
N2 - This paper presents a 1200 V, 120 A SiC phase-leg power module built in a novel low inductive 3D hybrid structure. The power module consists of DBC substrate and Flexible Printed Circuit (FPC) board equipped with SiC MOSFETs and diodes. The parasitic inductance of the power module is significantly minimized by using the FPC board and the proper layout design to 0.79 nH (extracted by Q3D). The power terminals are directly extended from the FPC board with only 0.85 nH stray inductance, and the DC decoupling capacitors are integrated in the module to decrease the peak turn-off voltage. The parasitic inductance of the module is verified by Impedance Analyzer measurement. Meanwhile, the double pulse test results show the switching speed of the FPC module is 1.6 times faster and has only half the overshoot voltage when compared with the commercial module. By integrating gate drivers, DC-link, and heatsink, the designed full SiC phase-leg 3D module has the potential to improve the power density.
AB - This paper presents a 1200 V, 120 A SiC phase-leg power module built in a novel low inductive 3D hybrid structure. The power module consists of DBC substrate and Flexible Printed Circuit (FPC) board equipped with SiC MOSFETs and diodes. The parasitic inductance of the power module is significantly minimized by using the FPC board and the proper layout design to 0.79 nH (extracted by Q3D). The power terminals are directly extended from the FPC board with only 0.85 nH stray inductance, and the DC decoupling capacitors are integrated in the module to decrease the peak turn-off voltage. The parasitic inductance of the module is verified by Impedance Analyzer measurement. Meanwhile, the double pulse test results show the switching speed of the FPC module is 1.6 times faster and has only half the overshoot voltage when compared with the commercial module. By integrating gate drivers, DC-link, and heatsink, the designed full SiC phase-leg 3D module has the potential to improve the power density.
KW - Flexible printed circuit board
KW - Hybrid packaging structure
KW - SiC phase-leg power module
UR - https://www.scopus.com/pages/publications/85041577011
U2 - 10.1109/ECCE.2017.8096698
DO - 10.1109/ECCE.2017.8096698
M3 - Conference contribution
T3 - 2017 IEEE Energy Conversion Congress and Exposition, ECCE 2017
SP - 3995
EP - 4002
BT - 2017 IEEE Energy Conversion Congress and Exposition, ECCE 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2017
Y2 - 1 October 2017 through 5 October 2017
ER -