Abstract
An advanced SOI PMOS polysilicon transistor, which features an inverted gate electrode and self-aligned source/drain and gate/channel regions, has been developed and characterized. Selective oxidation is used to form self-aligned thin polysilicon channel regions with thicker source/drain polysilicon regions. Excellent short-channel device characteristics were obtained, which indicate complete depletion of the thin polysilicon channel region.
| Original language | English |
|---|---|
| Pages (from-to) | 349-351 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 11 |
| Issue number | 8 |
| DOIs | |
| State | Published - Aug 1990 |
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