TY - GEN
T1 - A Study on Reliability of Pb40/Sn60 Solder Joints under Dynamic Loading
AU - Basaran, Cemal
AU - Chandaroy, Rumpa
N1 - Publisher Copyright: © 1997 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1997
Y1 - 1997
N2 - Solder interconnects are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in vibrating environment such as in automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue Ufe of solder interconnects in low-cycle and high cycle fatigue. The proposed material model, which is based on the Disturbed State Concept (D S C), is used for dynamic analysis of a solder joint.
AB - Solder interconnects are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in vibrating environment such as in automotive and military applications, dynamic stresses contribute to the failure mechanism of the solder joint and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue Ufe of solder interconnects in low-cycle and high cycle fatigue. The proposed material model, which is based on the Disturbed State Concept (D S C), is used for dynamic analysis of a solder joint.
UR - https://www.scopus.com/pages/publications/85126863818
U2 - 10.1115/IMECE1997-0822
DO - 10.1115/IMECE1997-0822
M3 - Conference contribution
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 227
EP - 242
BT - Structural Analysis in Microelectronics and Fiber Optics
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Structural Analysis in Microelectronics and Fiber Optics
Y2 - 16 November 1997 through 21 November 1997
ER -