TY - GEN
T1 - A world-to-chip microfluidic interconnection technology with dual functions of sample injection and sealing for a multichamber micro PCR chip
AU - Oh, Kwang W.
AU - Park, Chinsung
AU - Namkoong, Kak
PY - 2005
Y1 - 2005
N2 - This paper presents a practical world-to-chip microfluidic interconnection technology with dual functions of sample injection and sealing for a multichamber Micro PCR (Polymerase Chain Reaction) chip. After sample injection and sealing, leakage test is conducted by elevating the temperature upto 100°C for 30 min. No leakage flows are found during the test for 10 cartridges. In conclusion, we have introduced a simple and cheap microfluidic interconnection technology for both sample injection and sealing, which provides a zero dead volume, a zero leakage flow, and biochemical compatibility. Also, this world-to-chip interconnection technology enables one or more operators to interface between the micro world and real world easily by using conventional pipettes.
AB - This paper presents a practical world-to-chip microfluidic interconnection technology with dual functions of sample injection and sealing for a multichamber Micro PCR (Polymerase Chain Reaction) chip. After sample injection and sealing, leakage test is conducted by elevating the temperature upto 100°C for 30 min. No leakage flows are found during the test for 10 cartridges. In conclusion, we have introduced a simple and cheap microfluidic interconnection technology for both sample injection and sealing, which provides a zero dead volume, a zero leakage flow, and biochemical compatibility. Also, this world-to-chip interconnection technology enables one or more operators to interface between the micro world and real world easily by using conventional pipettes.
UR - https://www.scopus.com/pages/publications/26844540072
U2 - 10.1109/MEMSYS.2005.1454029
DO - 10.1109/MEMSYS.2005.1454029
M3 - Conference contribution
SN - 0780387325
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 714
EP - 717
BT - Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
T2 - 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
Y2 - 30 January 2005 through 3 February 2005
ER -