Advanced Wireless Packaging and Optimization for High Power WBG Modules

This paper summarizes the latest research from the author's group on high-power, high-voltage Silicon Carbide (SiC) module packages and Gallium Nitride (GaN) module packages using double-sided cooled structures. The speaker will discuss challenges in these module designs, such as interconnection issues, electromagnetic interference (EMI) mitigation, and fabrication processes, and propose potential solutions. The presentation will specifically cover the 3D SiC double-sided cooled (DSC) module design using fuzz button instead of soldering and sintering technologies. Toward the end, the presentation will briefly address the Figure-of-Merit for power module designs.