An overview of thermal management for next generation microelectronics devices

S. S. Tonapi; R. A. Fillion; F. J. Schattenmann; H. S. Cole; J. D. Evans; B. G. Sammakia

An overview of thermal management for next generation microelectronics devices

S. S. Tonapi
, R. A. Fillion
, F. J. Schattenmann
, H. S. Cole
, J. D. Evans
, B. G. Sammakia

Mechanical Engineering

Binghamton University

General Electric

Research output: Contribution to journal › Conference article › peer-review

33 Scopus citations

Abstract

The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

Original language	English
Pages (from-to)	250-254
Number of pages	5
Journal	IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
State	Published - 2003
Event	The 14th Annual IEEE/SEMI; Advanced Semiconductor Manufacturing Conference and Workshop 2003 - Munich, Germany Duration: Mar 31 2003 → Apr 1 2003

Keywords

Electronic packaging
Microelectronics
Thermal interface material
Thermal management

Cite this

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title = "An overview of thermal management for next generation microelectronics devices",

abstract = "The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.",

keywords = "Electronic packaging, Microelectronics, Thermal interface material, Thermal management",

author = "Tonapi, \{S. S.\} and Fillion, \{R. A.\} and Schattenmann, \{F. J.\} and Cole, \{H. S.\} and Evans, \{J. D.\} and Sammakia, \{B. G.\}",

year = "2003",

language = "English",

pages = "250--254",

journal = "IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings",

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note = "The 14th Annual IEEE/SEMI; Advanced Semiconductor Manufacturing Conference and Workshop 2003 ; Conference date: 31-03-2003 Through 01-04-2003",

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T1 - An overview of thermal management for next generation microelectronics devices

AU - Tonapi, S. S.

AU - Fillion, R. A.

AU - Schattenmann, F. J.

AU - Cole, H. S.

AU - Evans, J. D.

AU - Sammakia, B. G.

PY - 2003

Y1 - 2003

N2 - The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

AB - The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

KW - Electronic packaging

KW - Microelectronics

KW - Thermal interface material

KW - Thermal management

UR - https://www.scopus.com/pages/publications/0038180861

M3 - Conference article

SN - 1523-553X

SP - 250

EP - 254

JO - IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

JF - IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

T2 - The 14th Annual IEEE/SEMI; Advanced Semiconductor Manufacturing Conference and Workshop 2003

Y2 - 31 March 2003 through 1 April 2003

ER -

An overview of thermal management for next generation microelectronics devices

Abstract

Keywords

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