Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Richard Oechsner; M. Pfeffer; J. Frickinger; M. Schellenberger; G. Roeder; L. Pfitzner; H. Ryssel; M. Fritzsche; V. Kaushik; D. Renaud; A. Danel; C. Claeys; T. Bearda; M. Lering; M. Graef; B. Murphy; H. Walther; S. Hury

doi:10.1109/TSM.2007.901828

Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

Richard Oechsner
, M. Pfeffer
, J. Frickinger
, M. Schellenberger
, G. Roeder
, L. Pfitzner
, H. Ryssel
, M. Fritzsche
, V. Kaushik
, D. Renaud
, A. Danel
, C. Claeys
, T. Bearda
, M. Lering
, M. Graef
, B. Murphy
, H. Walther
, S. Hury

NY Creates Research Foundation

NY Creates

Fraunhofer Institute for Integrated Systems and Device Technology
Friedrich-Alexander University Erlangen-Nürnberg
Nanolay
CEA-LETI
IMEC
Infineon Technologies AG
Philips Semiconduclors
Siltronic AG
Enlegris
INCAM Solulions

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro and nano technologies to a distributed 300-mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multisite processing. An implementation phase is planned as a second step.

Original language	English
Pages (from-to)	215-221
Number of pages	7
Journal	IEEE Transactions on Semiconductor Manufacturing
Volume	20
Issue number	3
DOIs	https://doi.org/10.1109/TSM.2007.901828
State	Published - Aug 2007

Keywords

300 mm
Multisite processing
Nanotechnology
Semiconductor manufacturing

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10.1109/TSM.2007.901828

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Oechsner, R., Pfeffer, M., Frickinger, J., Schellenberger, M., Roeder, G., Pfitzner, L., Ryssel, H., Fritzsche, M., Kaushik, V., Renaud, D., Danel, A., Claeys, C., Bearda, T., Lering, M., Graef, M., Murphy, B., Walther, H., & Hury, S. (2007). Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites. IEEE Transactions on Semiconductor Manufacturing, 20(3), 215-221. https://doi.org/10.1109/TSM.2007.901828

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title = "Approach for a standardized methodology for multisite processing of 300-mm wafers at R\&D sites",

abstract = "This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R\&D centers in micro and nano technologies to a distributed 300-mm CMOS R\&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R\&D nodes to allow multisite processing. An implementation phase is planned as a second step.",

keywords = "300 mm, Multisite processing, Nanotechnology, Semiconductor manufacturing",

author = "Richard Oechsner and M. Pfeffer and J. Frickinger and M. Schellenberger and G. Roeder and L. Pfitzner and H. Ryssel and M. Fritzsche and V. Kaushik and D. Renaud and A. Danel and C. Claeys and T. Bearda and M. Lering and M. Graef and B. Murphy and H. Walther and S. Hury",

year = "2007",

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doi = "10.1109/TSM.2007.901828",

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volume = "20",

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Oechsner, R, Pfeffer, M, Frickinger, J, Schellenberger, M, Roeder, G, Pfitzner, L, Ryssel, H, Fritzsche, M, Kaushik, V, Renaud, D, Danel, A, Claeys, C, Bearda, T, Lering, M, Graef, M, Murphy, B, Walther, H & Hury, S 2007, 'Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites', IEEE Transactions on Semiconductor Manufacturing, vol. 20, no. 3, pp. 215-221. https://doi.org/10.1109/TSM.2007.901828

TY - JOUR

T1 - Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

AU - Oechsner, Richard

AU - Pfeffer, M.

AU - Frickinger, J.

AU - Schellenberger, M.

AU - Roeder, G.

AU - Pfitzner, L.

AU - Ryssel, H.

AU - Fritzsche, M.

AU - Kaushik, V.

AU - Renaud, D.

AU - Danel, A.

AU - Claeys, C.

AU - Bearda, T.

AU - Lering, M.

AU - Graef, M.

AU - Murphy, B.

AU - Walther, H.

AU - Hury, S.

PY - 2007/8

Y1 - 2007/8

N2 - This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro and nano technologies to a distributed 300-mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multisite processing. An implementation phase is planned as a second step.

AB - This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro and nano technologies to a distributed 300-mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multisite processing. An implementation phase is planned as a second step.

KW - 300 mm

KW - Multisite processing

KW - Nanotechnology

KW - Semiconductor manufacturing

UR - https://www.scopus.com/pages/publications/34547756321

U2 - 10.1109/TSM.2007.901828

DO - 10.1109/TSM.2007.901828

M3 - Article

SN - 0894-6507

VL - 20

SP - 215

EP - 221

JO - IEEE Transactions on Semiconductor Manufacturing

JF - IEEE Transactions on Semiconductor Manufacturing

IS - 3

ER -

Approach for a standardized methodology for multisite processing of 300-mm wafers at R&D sites

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Keywords

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