BSCCO-2212 thick films on a flexible YSZ substrate

Shu jan Chen; Sushil Patel; Eiki Narumi; David T. Shaw; Dell St. Julien; Thomas D. Ketcham

doi:10.1016/0921-4534(93)90282-U

BSCCO-2212 thick films on a flexible YSZ substrate

Shu jan Chen
, Sushil Patel
, Eiki Narumi
, David T. Shaw
, Dell St. Julien
, Thomas D. Ketcham

Department of Electrical Engineering

University at Buffalo

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, T_c, (<50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The T_c was significantly improved (> 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, J_c, also improved with increasing buffer-layer thickness. The self-field J_c of these Bi-2212/Ag/YSZ composites was 1-3×10³ A/cm² at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-T_c pancake coils. The microstructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.

Original language	English
Pages (from-to)	191-196
Number of pages	6
Journal	Physica C: Superconductivity and its applications
Volume	218
Issue number	1-2
DOIs	https://doi.org/10.1016/0921-4534(93)90282-U
State	Published - Dec 1 1993

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@article{4bd8dbef7b8f4ab2a7b1e70a8f15c634,

title = "BSCCO-2212 thick films on a flexible YSZ substrate",

abstract = "The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, Tc, (<50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The Tc was significantly improved (> 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, Jc, also improved with increasing buffer-layer thickness. The self-field Jc of these Bi-2212/Ag/YSZ composites was 1-3×103 A/cm2 at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-Tc pancake coils. The microstructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.",

author = "Chen, \{Shu jan\} and Sushil Patel and Eiki Narumi and Shaw, \{David T.\} and \{St. Julien\}, Dell and Ketcham, \{Thomas D.\}",

year = "1993",

month = dec,

day = "1",

doi = "10.1016/0921-4534(93)90282-U",

language = "English",

volume = "218",

pages = "191--196",

journal = "Physica C: Superconductivity and its applications",

issn = "0921-4534",

publisher = "Elsevier B.V.",

number = "1-2",

}

TY - JOUR

T1 - BSCCO-2212 thick films on a flexible YSZ substrate

AU - Chen, Shu jan

AU - Patel, Sushil

AU - Narumi, Eiki

AU - Shaw, David T.

AU - St. Julien, Dell

AU - Ketcham, Thomas D.

PY - 1993/12/1

Y1 - 1993/12/1

N2 - The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, Tc, (<50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The Tc was significantly improved (> 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, Jc, also improved with increasing buffer-layer thickness. The self-field Jc of these Bi-2212/Ag/YSZ composites was 1-3×103 A/cm2 at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-Tc pancake coils. The microstructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.

AB - The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, Tc, (<50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The Tc was significantly improved (> 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, Jc, also improved with increasing buffer-layer thickness. The self-field Jc of these Bi-2212/Ag/YSZ composites was 1-3×103 A/cm2 at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-Tc pancake coils. The microstructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.

UR - https://www.scopus.com/pages/publications/0027881601

U2 - 10.1016/0921-4534(93)90282-U

DO - 10.1016/0921-4534(93)90282-U

M3 - Article

SN - 0921-4534

VL - 218

SP - 191

EP - 196

JO - Physica C: Superconductivity and its applications

JF - Physica C: Superconductivity and its applications

IS - 1-2

ER -

BSCCO-2212 thick films on a flexible YSZ substrate

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