Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples

W. K. Neils; R. R. Chromik; K. F. Dreyer; D. Grosman; E. J. Cotts

Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu₆Sn₅ thin film diffusion couples

W. K. Neils
, R. R. Chromik
, K. F. Dreyer
, D. Grosman
, E. J. Cotts

Physics

Binghamton University

State University of New York Binghamton University

Research output: Contribution to journal › Conference article › peer-review

4 Scopus citations

Abstract

We find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiffusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu₆Sn₅ diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu₃Sn from Cu₆Sn₅ and Cu thin films was found to be ΔH_r = -4.3 ± 0.3 kJ/mol. Portions of our differential scanning calorimetry scans are identified with diffusion limited growth of Cu₃Sn. From these calorimetry data we have estimated D̄(cm²/s) = D_o exp(-E/k_bT), where k_b is Boltzmann's constant, D_o = 3.2 × 10^-2 cm²/s, and E=0.87 eV/atom.

Original language	English
Pages (from-to)	313-318
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	398
State	Published - 1996
Event	Proceedings of the 1995 MRS Fall Meeting - Boston, MA, USA Duration: Nov 27 1995 → Dec 2 1995

Cite this

@article{2b3ace91cd4b4424940022f40d7e8fbf,

title = "Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples",

abstract = "We find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiffusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu6Sn5 diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu3Sn from Cu6Sn5 and Cu thin films was found to be ΔHr = -4.3 ± 0.3 kJ/mol. Portions of our differential scanning calorimetry scans are identified with diffusion limited growth of Cu3Sn. From these calorimetry data we have estimated {\=D}(cm2/s) = Do exp(-E/kbT), where kb is Boltzmann's constant, Do = 3.2 × 10-2 cm2/s, and E=0.87 eV/atom.",

author = "Neils, \{W. K.\} and Chromik, \{R. R.\} and Dreyer, \{K. F.\} and D. Grosman and Cotts, \{E. J.\}",

year = "1996",

language = "English",

volume = "398",

pages = "313--318",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

note = "Proceedings of the 1995 MRS Fall Meeting ; Conference date: 27-11-1995 Through 02-12-1995",

}

TY - JOUR

T1 - Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples

AU - Neils, W. K.

AU - Chromik, R. R.

AU - Dreyer, K. F.

AU - Grosman, D.

AU - Cotts, E. J.

PY - 1996

Y1 - 1996

N2 - We find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiffusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu6Sn5 diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu3Sn from Cu6Sn5 and Cu thin films was found to be ΔHr = -4.3 ± 0.3 kJ/mol. Portions of our differential scanning calorimetry scans are identified with diffusion limited growth of Cu3Sn. From these calorimetry data we have estimated D̄(cm2/s) = Do exp(-E/kbT), where kb is Boltzmann's constant, Do = 3.2 × 10-2 cm2/s, and E=0.87 eV/atom.

AB - We find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiffusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu6Sn5 diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu3Sn from Cu6Sn5 and Cu thin films was found to be ΔHr = -4.3 ± 0.3 kJ/mol. Portions of our differential scanning calorimetry scans are identified with diffusion limited growth of Cu3Sn. From these calorimetry data we have estimated D̄(cm2/s) = Do exp(-E/kbT), where kb is Boltzmann's constant, Do = 3.2 × 10-2 cm2/s, and E=0.87 eV/atom.

UR - https://www.scopus.com/pages/publications/0029766761

M3 - Conference article

SN - 0272-9172

VL - 398

SP - 313

EP - 318

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1995 MRS Fall Meeting

Y2 - 27 November 1995 through 2 December 1995

ER -

Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu₆Sn₅ thin film diffusion couples

Abstract

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