TY - GEN
T1 - Characterization of the mechanical properties of actual solder joints using DIC
AU - Nguyen, Tung T.
AU - Park, Seungbae
PY - 2011
Y1 - 2011
N2 - This paper presents the characterization of the elasto-plastic behavior of actual Sn-1.0wt.%Ag-0.5wt.%Cu (SAC105), Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) and Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) solder joints. Several actual ChipArray BGA (CABGA) packages were cross-sectioned, polished and used as the test vehicles. Several testers were specially designed and fabricated for the characterization of the material properties using the customized test vehicle. Compressive and drop tests were performed to generate elastic and inelastic deformations, respectively, in the solder joints. Images of the cross-sectioned solder joints were recorded using microscope during the tests. The recorded images were then processed by using a digital image correlation (DIC) program to calculate the displacement and strain fields on the solder joints. Finite element method (FEM) modeling was used to extract the material properties.
AB - This paper presents the characterization of the elasto-plastic behavior of actual Sn-1.0wt.%Ag-0.5wt.%Cu (SAC105), Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) and Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) solder joints. Several actual ChipArray BGA (CABGA) packages were cross-sectioned, polished and used as the test vehicles. Several testers were specially designed and fabricated for the characterization of the material properties using the customized test vehicle. Compressive and drop tests were performed to generate elastic and inelastic deformations, respectively, in the solder joints. Images of the cross-sectioned solder joints were recorded using microscope during the tests. The recorded images were then processed by using a digital image correlation (DIC) program to calculate the displacement and strain fields on the solder joints. Finite element method (FEM) modeling was used to extract the material properties.
UR - https://www.scopus.com/pages/publications/79960387331
U2 - 10.1109/ECTC.2011.5898812
DO - 10.1109/ECTC.2011.5898812
M3 - Conference contribution
SN - 9781612844978
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2126
EP - 2129
BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011
Y2 - 31 May 2011 through 3 June 2011
ER -