TY - GEN
T1 - Comparative numerical analysis of angled branching microchannel heat sink
AU - Chen, Cheng
AU - Samadiani, Emad
AU - Sammakia, Bahgat
PY - 2013
Y1 - 2013
N2 - Branching microchannel networks have been considered as an effective liquid cooling system for electronic components. In this paper, an asymmetric angled branching design of microchannel network is introduced and compared with the parallel branching cooling system. Full CFD models based on finite-element analysis are established to analyze their thermal performances under uniform heat distribution. Performances of angled branching network and a series of parallel networks are compared for a pressure range from 0.5psi to 4psi. Results indicate that the angled branching network dissipates heat better at lower provided pressure drop due to its small flow resistance and flexibility in fluid transportation. On the other hand, a lower peak temperature is noted for the parallel branching network at higher pressure head.
AB - Branching microchannel networks have been considered as an effective liquid cooling system for electronic components. In this paper, an asymmetric angled branching design of microchannel network is introduced and compared with the parallel branching cooling system. Full CFD models based on finite-element analysis are established to analyze their thermal performances under uniform heat distribution. Performances of angled branching network and a series of parallel networks are compared for a pressure range from 0.5psi to 4psi. Results indicate that the angled branching network dissipates heat better at lower provided pressure drop due to its small flow resistance and flexibility in fluid transportation. On the other hand, a lower peak temperature is noted for the parallel branching network at higher pressure head.
UR - https://www.scopus.com/pages/publications/84894652406
U2 - 10.1115/IPACK2013-73141
DO - 10.1115/IPACK2013-73141
M3 - Conference contribution
SN - 9780791855768
T3 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
T2 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Y2 - 16 July 2013 through 18 July 2013
ER -