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Comparative study of non-polar switching behaviors of NiO- and HfO 2-based oxide resistive-RAMs

  • V. Jousseaume
  • , A. Fantini
  • , J. F. Nodin
  • , C. Guedj
  • , A. Persico
  • , J. Buckley
  • , S. Tirano
  • , P. Lorenzi
  • , R. Vignon
  • , H. Feldis
  • , S. Minoret
  • , H. Grampeix
  • , A. Roule
  • , S. Favier
  • , E. Martinez
  • , P. Calka
  • , N. Rochat
  • , G. Auvert
  • , J. P. Barnes
  • , P. Gonon
  • C. Vallée, L. Perniola, B. De Salvo
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université de Provence
  • CNRS

Research output: Contribution to journalArticlepeer-review

20 Scopus citations

Abstract

This paper presents a detailed comparative study of the switching characteristics of resistive memory devices, with NiO or HfO2 active materials and Pt electrodes, based on identical integration schemes. Material screening and qualification are performed using structural and composition analyses. Preliminary electrical investigations outline the non-polar switching behavior of both HfO2 and NiO devices. Then, by using a specific test setup, we present a systematic comparative study of HfO2 and NiO devices, clearly showing the tunability of the electrical characteristics with material type and process. HfO2 devices lead to largest High Resistance State/Low Resistance State ratios and higher forming voltages compared to NiO cells, while reset voltages are similar. Data retention of both materials show highly stable Low Resistance State, while High Resistance State increases over time under 85 °C baking.

Original languageEnglish
Pages (from-to)62-67
Number of pages6
JournalSolid-State Electronics
Volume58
Issue number1
DOIs
StatePublished - Apr 2011

Keywords

  • Forming
  • MIM
  • Memory
  • Ox-RRAM

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