Skip to main navigation Skip to search Skip to main content

Compressive behavior of aluminum/copper hybrid foams under high strain rate loading

  • Yi Sun
  • , Rigoberto Burgueño
  • , Andy J. Vanderklok
  • , Srinivasan Arjun Tekalur
  • , Wei Wang
  • , Ilsoon Lee
  • Michigan State University

Research output: Contribution to journalArticlepeer-review

44 Scopus citations

Abstract

The accessible interconnected structure of open-cell metal foams offers the opportunity to create hybrid foam materials through electrodeposited metal coatings, which has great potential for the fabrication of functionally-graded foam systems. Nanocopper coated aluminum (Al) foam was created by reinforcing conventional open-cell Al foams with electrodeposited nanocrystalline copper (Cu). The mechanical properties of such Al/Cu hybrid foam under high strain-rate compression were investigated using a split Hopkinson pressure bar and numerical methods were used to gain a further understanding on the micro-scale failure mechanisms. It was found that the stable compressive response of open-cell Al foam can be effectively enhanced by electrodeposited nanocopper coatings. However, such enhancement is limited by the relatively high brittleness of the Al/Cu hybrid foam due to the low ductility level of the electrodeposited nano-coating material. Nonetheless, this study also shows that the overall energy absorption performance of Al/Cu hybrid foams under high strain rate loading can be significantly improved by increasing the ductility level of the electrodeposited copper coating.

Original languageEnglish
Pages (from-to)111-120
Number of pages10
JournalMaterials Science and Engineering: A
Volume592
DOIs
StatePublished - Jan 13 2014

Keywords

  • Electrodeposition
  • Energy absorption
  • Finite element methods
  • High strain rate
  • Hybrid open-cell foams
  • Nanocrystalline materials

Fingerprint

Dive into the research topics of 'Compressive behavior of aluminum/copper hybrid foams under high strain rate loading'. Together they form a unique fingerprint.

Cite this