Computer aided process planning for tape automated bonding

Sundarraman Raghavan; K. Srihari

doi:10.1016/0360-8352(91)90062-B

Computer aided process planning for tape automated bonding

Sundarraman Raghavan
, K. Srihari

School of Sys Sci Ind Engr

Binghamton University

State University of New York Binghamton University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This paper describes the design and development of a knowledge based Computer Aided Process Planning (CAPP) system for Printed Circuit Board assembly. The domain considered uses both Surface Mount Technology (SMT) and Tape Automated Bonding (TAB) components. The structure and design of the CAPP system, and its inputs and outputs are discussed.

Original language	English
Pages (from-to)	51-55
Number of pages	5
Journal	Computers and Industrial Engineering
Volume	21
Issue number	1-4
DOIs	https://doi.org/10.1016/0360-8352(91)90062-B
State	Published - 1991

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10.1016/0360-8352(91)90062-B

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title = "Computer aided process planning for tape automated bonding",

abstract = "This paper describes the design and development of a knowledge based Computer Aided Process Planning (CAPP) system for Printed Circuit Board assembly. The domain considered uses both Surface Mount Technology (SMT) and Tape Automated Bonding (TAB) components. The structure and design of the CAPP system, and its inputs and outputs are discussed.",

author = "Sundarraman Raghavan and K. Srihari",

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doi = "10.1016/0360-8352(91)90062-B",

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AB - This paper describes the design and development of a knowledge based Computer Aided Process Planning (CAPP) system for Printed Circuit Board assembly. The domain considered uses both Surface Mount Technology (SMT) and Tape Automated Bonding (TAB) components. The structure and design of the CAPP system, and its inputs and outputs are discussed.

UR - https://www.scopus.com/pages/publications/0344591371

U2 - 10.1016/0360-8352(91)90062-B

DO - 10.1016/0360-8352(91)90062-B

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VL - 21

SP - 51

EP - 55

JO - Computers and Industrial Engineering

JF - Computers and Industrial Engineering

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Computer aided process planning for tape automated bonding

Abstract

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