TY - GEN
T1 - Continuous nano/micro-machining and weaving integration process for fiber substrates
AU - Itoh, Toshihiro
AU - Takamatsu, Seiichi
AU - Kobayashi, Takeshi
AU - Shibayama, Nobuhisa
AU - Miyake, Koji
PY - 2010
Y1 - 2010
N2 - We report on the reel to reel process including coating and patterning fibers and their weaving integration process for the application to large area (> 1 m2) MEMS devices. Firstly, large area applications are discussed and the difficulty to apply MEMS process to meter-scale devices regarding on throughput and high-cost of materials are pointed out. Secondly, toward high throughput processing, we proposed the die-coating technology applied to plastic fibers and the weaving of them, forming large area-device. To solve the high cost of materials, we proposed to utilize plastic fiber substrates and organic electronic material as low cost materials. Thirdly, we established the device fabrication process and fabricated a 30 cm × 30 cm pressure sensor array. Finally, its mechanical and electrical properties were examined and pressure sensing was demonstrated using fabricated device. The developed process will lead to large area pressure sensors and other electronic devices.
AB - We report on the reel to reel process including coating and patterning fibers and their weaving integration process for the application to large area (> 1 m2) MEMS devices. Firstly, large area applications are discussed and the difficulty to apply MEMS process to meter-scale devices regarding on throughput and high-cost of materials are pointed out. Secondly, toward high throughput processing, we proposed the die-coating technology applied to plastic fibers and the weaving of them, forming large area-device. To solve the high cost of materials, we proposed to utilize plastic fiber substrates and organic electronic material as low cost materials. Thirdly, we established the device fabrication process and fabricated a 30 cm × 30 cm pressure sensor array. Finally, its mechanical and electrical properties were examined and pressure sensing was demonstrated using fabricated device. The developed process will lead to large area pressure sensors and other electronic devices.
KW - Die-coating
KW - Large area electronics
KW - PEDOT: PSS
KW - Pressure sensor
KW - Weaving
UR - https://www.scopus.com/pages/publications/77957852522
M3 - Conference contribution
SN - 9782355000119
T3 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
SP - 320
EP - 325
BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Y2 - 5 May 2010 through 7 May 2010
ER -