Critical requirements for next generation modeling and simulation tools

The modeling and simulation technology needs and the challenges posed by RF/wireless products and embedded passives, along with techniques such as mechanical and reliability modeling, thermal and thermo-fluid simulation, and electrical simulation are discussed. Simulations are considered helpful in determining performance/cost trade-offs and gain insight for future product/process design. Mechanical reliability is said to be the major focus for all the sectors covered in the Roadmap. The techniques, which can ensure greater product reliability include interfacial delamination, moisture modeling, and solder joint reliability. The requirement of low-cost, high-I/Q packaging calls for the adoption of wafer-level and 3D packaging. Electromagnetic coupling between the lines of the high-frequency RF design require efficient tools with fast convergence time, while the design interface needs robust interfaces to transfer data.