Abstract
The current status of EUV resists is reviewed based on performance studies of line edge roughness (LER), sensitivity, resolution and pattern transfer. A large variation in polymer molecular weight (2.9-33.5 K g/mol) is found to have little effect on LER. Dissolution properties such as unexposed film thickness loss (UFTL) are shown to have a large effect on LER. Increasing resist contrast and image contrast are shown to improve resist LER. Variation in base level within resists based on EUV-2D shows a clear trade-off between sensitivity and LER. Acid difusion can play an important role in determining LER. Resist resolution and image transfer capabilities are also discussed.
| Original language | English |
|---|---|
| Pages (from-to) | 401-410 |
| Number of pages | 10 |
| Journal | Journal of Photopolymer Science and Technology |
| Volume | 16 |
| Issue number | 3 |
| DOIs | |
| State | Published - 2003 |
Keywords
- EUVL
- Extreme Ultraviolet Lithography
- Line-edge roughness
- Photoresist
- Photospeed
- Resolution
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