TY - GEN
T1 - Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
AU - Morgan, Adam J.
AU - Xu, Yang
AU - Hopkins, Douglas C.
AU - Husain, Iqbal
AU - Yu, Wensong
N1 - Publisher Copyright: © 2016 IEEE.
PY - 2016/5/10
Y1 - 2016/5/10
N2 - The CREE 1200V/50A, 25mω 6-Pack SiC MOSFET module (CCS050M12CM2) is decomposed into a full 3D CAD model, and materials identified, for use in electrical circuit and multi-physics simulations. A reverse engineering technique is first developed, outlined, and then demonstrated on the CREE module. The ANSYS Q3D Extractor is applied to the 3D CAD model where electrical, lumped parameter, parasitic circuit elements are determined. The model is also analyzed with a multi-physics simulator to provide in-situ thermal maps of the baseplate surface for application scenarios, e.g. with a thermal interface material and pin fin heat sink to capture the thermal spreading from junction to case. The complete model is made open source and freely distributed for use by the reader.
AB - The CREE 1200V/50A, 25mω 6-Pack SiC MOSFET module (CCS050M12CM2) is decomposed into a full 3D CAD model, and materials identified, for use in electrical circuit and multi-physics simulations. A reverse engineering technique is first developed, outlined, and then demonstrated on the CREE module. The ANSYS Q3D Extractor is applied to the 3D CAD model where electrical, lumped parameter, parasitic circuit elements are determined. The model is also analyzed with a multi-physics simulator to provide in-situ thermal maps of the baseplate surface for application scenarios, e.g. with a thermal interface material and pin fin heat sink to capture the thermal spreading from junction to case. The complete model is made open source and freely distributed for use by the reader.
KW - CREE Module
KW - Lumped Parameter Model
KW - Parasitic Impedances
KW - Thermal Model
UR - https://www.scopus.com/pages/publications/84973661666
U2 - 10.1109/APEC.2016.7468163
DO - 10.1109/APEC.2016.7468163
M3 - Conference contribution
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 2141
EP - 2146
BT - 2016 IEEE Applied Power Electronics Conference and Exposition, APEC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2016
Y2 - 20 March 2016 through 24 March 2016
ER -