Delamination trends of underfill in DCA assemblies

Y. Sha; C. Y. Hui; E. J. Kramer; P. Borgesen; G. Westby

Delamination trends of underfill in DCA assemblies

Y. Sha
, C. Y. Hui
, E. J. Kramer
, P. Borgesen
, G. Westby

School of Sys Sci Ind Engr

Binghamton University

Cornell University

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.

Original language	English
Pages (from-to)	3-8
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	445
State	Published - 1997
Event	Proceedings of the 1996 MRS Fall Symposium - Boston, MA, USA Duration: Dec 2 1996 → Dec 5 1996

Cite this

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title = "Delamination trends of underfill in DCA assemblies",

abstract = "Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.",

author = "Y. Sha and Hui, \{C. Y.\} and Kramer, \{E. J.\} and P. Borgesen and G. Westby",

year = "1997",

language = "English",

volume = "445",

pages = "3--8",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

note = "Proceedings of the 1996 MRS Fall Symposium ; Conference date: 02-12-1996 Through 05-12-1996",

}

TY - JOUR

T1 - Delamination trends of underfill in DCA assemblies

AU - Sha, Y.

AU - Hui, C. Y.

AU - Kramer, E. J.

AU - Borgesen, P.

AU - Westby, G.

PY - 1997

Y1 - 1997

N2 - Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.

AB - Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.

UR - https://www.scopus.com/pages/publications/0031335418

M3 - Conference article

SN - 0272-9172

VL - 445

SP - 3

EP - 8

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1996 MRS Fall Symposium

Y2 - 2 December 1996 through 5 December 1996

ER -

Delamination trends of underfill in DCA assemblies

Abstract

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