Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

Krishna T. Settaluri; Sen Lin; Sajjad Moazeni; Erman Timurdogan; Chen Sun; Michele Moresco; Zhan Su; Yu Hsin Chen; Gerald Leake; Douglas Latulipe; Colin McDonough; Jeremiah Hebding; Douglas Coolbaugh; Michael Watts; Vladimir Stojanović

doi:10.1109/ESSCIRC.2015.7313852

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

Krishna T. Settaluri
, Sen Lin
, Sajjad Moazeni
, Erman Timurdogan
, Chen Sun
, Michele Moresco
, Zhan Su
, Yu Hsin Chen
, Gerald Leake
, Douglas Latulipe
, Colin McDonough
, Jeremiah Hebding
, Douglas Coolbaugh
, Michael Watts
, Vladimir Stojanović

NY Creates Research Foundation

NY Creates

University of California at Berkeley
Massachusetts Institute of Technology
SUNY Polytechnic Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

36 Scopus citations

Abstract

A full optical chip-to-chip link is demonstrated for the first time in a wafer-scale heterogeneous platform, where the photonics and CMOS chips are 3D integrated using wafer bonding and low-parasitic capacitance thru-oxide vias (TOVs). This development platform yields 1000s of functional photonic components as well as 16M transistors per chip module. The transmitter operates at 6Gb/s with an energy cost of 100fJ/bit and the receiver at 7Gb/s with a sensitivity of 26μA (-14.5dBm) and 340fJ/bit energy consumption. A full 5Gb/s chip-to-chip link, with the on-chip calibration and self-test, is demonstrated over a 100m single mode optical fiber with 560fJ/bit of electrical and 4.2pJ/bit of optical energy.

Original language	English
Title of host publication	ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference
Editors	Franz Dielacher, Wolfgang Pribyl, Gernot Hueber
Publisher	IEEE Computer Society
Pages	156-159
Number of pages	4
ISBN (Electronic)	9781467374705
DOIs	https://doi.org/10.1109/ESSCIRC.2015.7313852
State	Published - Oct 30 2015
Event	41st European Solid-State Circuits Conference, ESSCIRC 2015 - Graz, Austria Duration: Sep 14 2015 → Sep 18 2015

Publication series

Name	European Solid-State Circuits Conference
Volume	2015-October

Conference

Conference	41st European Solid-State Circuits Conference, ESSCIRC 2015
Country/Territory	Austria
City	Graz
Period	09/14/15 → 09/18/15

Keywords

3D integration
heterogeneous
link
optics
transceivers

Access to Document

10.1109/ESSCIRC.2015.7313852

Cite this

Settaluri, K. T., Lin, S., Moazeni, S., Timurdogan, E., Sun, C., Moresco, M., Su, Z., Chen, Y. H., Leake, G., Latulipe, D., McDonough, C., Hebding, J., Coolbaugh, D., Watts, M., & Stojanović, V. (2015). Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. In F. Dielacher, W. Pribyl, & G. Hueber (Eds.), ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference (pp. 156-159). Article 7313852 (European Solid-State Circuits Conference; Vol. 2015-October). IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2015.7313852

Settaluri, Krishna T. ; Lin, Sen ; Moazeni, Sajjad et al. / Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference. editor / Franz Dielacher ; Wolfgang Pribyl ; Gernot Hueber. IEEE Computer Society, 2015. pp. 156-159 (European Solid-State Circuits Conference).

@inproceedings{fbd51d3fe4db48758806d53e6e730e10,

title = "Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform",

abstract = "A full optical chip-to-chip link is demonstrated for the first time in a wafer-scale heterogeneous platform, where the photonics and CMOS chips are 3D integrated using wafer bonding and low-parasitic capacitance thru-oxide vias (TOVs). This development platform yields 1000s of functional photonic components as well as 16M transistors per chip module. The transmitter operates at 6Gb/s with an energy cost of 100fJ/bit and the receiver at 7Gb/s with a sensitivity of 26μA (-14.5dBm) and 340fJ/bit energy consumption. A full 5Gb/s chip-to-chip link, with the on-chip calibration and self-test, is demonstrated over a 100m single mode optical fiber with 560fJ/bit of electrical and 4.2pJ/bit of optical energy.",

keywords = "3D integration, heterogeneous, link, optics, transceivers",

author = "Settaluri, \{Krishna T.\} and Sen Lin and Sajjad Moazeni and Erman Timurdogan and Chen Sun and Michele Moresco and Zhan Su and Chen, \{Yu Hsin\} and Gerald Leake and Douglas Latulipe and Colin McDonough and Jeremiah Hebding and Douglas Coolbaugh and Michael Watts and Vladimir Stojanovi{\'c}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 41st European Solid-State Circuits Conference, ESSCIRC 2015 ; Conference date: 14-09-2015 Through 18-09-2015",

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doi = "10.1109/ESSCIRC.2015.7313852",

language = "English",

series = "European Solid-State Circuits Conference",

publisher = "IEEE Computer Society",

pages = "156--159",

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}

Settaluri, KT, Lin, S, Moazeni, S, Timurdogan, E, Sun, C, Moresco, M, Su, Z, Chen, YH, Leake, G, Latulipe, D, McDonough, C, Hebding, J, Coolbaugh, D, Watts, M & Stojanović, V 2015, Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. in F Dielacher, W Pribyl & G Hueber (eds), ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference., 7313852, European Solid-State Circuits Conference, vol. 2015-October, IEEE Computer Society, pp. 156-159, 41st European Solid-State Circuits Conference, ESSCIRC 2015, Graz, Austria, 09/14/15. https://doi.org/10.1109/ESSCIRC.2015.7313852

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. / Settaluri, Krishna T.; Lin, Sen; Moazeni, Sajjad et al.
ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference. ed. / Franz Dielacher; Wolfgang Pribyl; Gernot Hueber. IEEE Computer Society, 2015. p. 156-159 7313852 (European Solid-State Circuits Conference; Vol. 2015-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

AU - Settaluri, Krishna T.

AU - Lin, Sen

AU - Moazeni, Sajjad

AU - Timurdogan, Erman

AU - Sun, Chen

AU - Moresco, Michele

AU - Su, Zhan

AU - Chen, Yu Hsin

AU - Leake, Gerald

AU - Latulipe, Douglas

AU - McDonough, Colin

AU - Hebding, Jeremiah

AU - Coolbaugh, Douglas

AU - Watts, Michael

AU - Stojanović, Vladimir

PY - 2015/10/30

Y1 - 2015/10/30

N2 - A full optical chip-to-chip link is demonstrated for the first time in a wafer-scale heterogeneous platform, where the photonics and CMOS chips are 3D integrated using wafer bonding and low-parasitic capacitance thru-oxide vias (TOVs). This development platform yields 1000s of functional photonic components as well as 16M transistors per chip module. The transmitter operates at 6Gb/s with an energy cost of 100fJ/bit and the receiver at 7Gb/s with a sensitivity of 26μA (-14.5dBm) and 340fJ/bit energy consumption. A full 5Gb/s chip-to-chip link, with the on-chip calibration and self-test, is demonstrated over a 100m single mode optical fiber with 560fJ/bit of electrical and 4.2pJ/bit of optical energy.

AB - A full optical chip-to-chip link is demonstrated for the first time in a wafer-scale heterogeneous platform, where the photonics and CMOS chips are 3D integrated using wafer bonding and low-parasitic capacitance thru-oxide vias (TOVs). This development platform yields 1000s of functional photonic components as well as 16M transistors per chip module. The transmitter operates at 6Gb/s with an energy cost of 100fJ/bit and the receiver at 7Gb/s with a sensitivity of 26μA (-14.5dBm) and 340fJ/bit energy consumption. A full 5Gb/s chip-to-chip link, with the on-chip calibration and self-test, is demonstrated over a 100m single mode optical fiber with 560fJ/bit of electrical and 4.2pJ/bit of optical energy.

KW - 3D integration

KW - heterogeneous

KW - link

KW - optics

KW - transceivers

UR - https://www.scopus.com/pages/publications/84958779490

U2 - 10.1109/ESSCIRC.2015.7313852

DO - 10.1109/ESSCIRC.2015.7313852

M3 - Conference contribution

T3 - European Solid-State Circuits Conference

SP - 156

EP - 159

BT - ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference

A2 - Dielacher, Franz

A2 - Pribyl, Wolfgang

A2 - Hueber, Gernot

PB - IEEE Computer Society

T2 - 41st European Solid-State Circuits Conference, ESSCIRC 2015

Y2 - 14 September 2015 through 18 September 2015

ER -

Settaluri KT, Lin S, Moazeni S, Timurdogan E, Sun C, Moresco M et al. Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. In Dielacher F, Pribyl W, Hueber G, editors, ESSCIRC 2015 - Proceedings of the 41st European Solid-State Circuits Conference. IEEE Computer Society. 2015. p. 156-159. 7313852. (European Solid-State Circuits Conference). doi: 10.1109/ESSCIRC.2015.7313852

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

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Keywords

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