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Distributed artificial intelligence in process control

  • State University of New York Binghamton University

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

A distributed artificial intelligence based system for process planning in surface mount printed circuit board assembly was designed and developed. Multiple intelligent agents work together to read a CAD drawing of an assembly and subsequently deduce the process instructions needed. The system can also review a board from a 'design for manufacturing' perspective and identify the cost of assembly. It uses fuzzy logic to deal with domain related uncertainty. Object oriented programming concepts have been used in system implementation.

Original languageEnglish
Pages (from-to)397-400
Number of pages4
JournalComputers and Industrial Engineering
Volume31
Issue number1-2
DOIs
StatePublished - Oct 1996

Keywords

  • Distributed artificial intelligence
  • Printed wiring board assembly
  • Process planning

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