Dynamic reduced electrothermal model for Integrated Power Electronics Modules (IPEM)

M. Hernández-Mora; J. E. González; M. Vélez-Reyes; J. M. Ortiz-Rodríguez; Y. Pang; E. Scott

doi:10.1115/1.1827264

Dynamic reduced electrothermal model for Integrated Power Electronics Modules (IPEM)

M. Hernández-Mora
, J. E. González
, M. Vélez-Reyes
, J. M. Ortiz-Rodríguez
, Y. Pang
, E. Scott

Atmospheric Sciences Rsch Center

University at Albany

University of Puerto Rico
Virginia Polytechnic Institute and State University

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

A reduced mathematical model of the thermal behavior of integrated power electronics module (IPEM) is discussed. The proposed model is an efficient compact thermal model of the IPEM based on lumped thermal capacitance model. The model is validated against a full three dimensional finite volume approach and with experimental data, to make it very efficient and accurate. The reduced electrothermal models are found to be excellent alternative for design methodologies of new generations of IPEMs.

Original language	English
Pages (from-to)	477-490
Number of pages	14
Journal	Journal of Electronic Packaging
Volume	126
Issue number	4
DOIs	https://doi.org/10.1115/1.1827264
State	Published - Dec 2004

Keywords

Integrated Power Electronics
Lumped Thermal Capacitance
Reduced Thermal Model

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10.1115/1.1827264

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abstract = "A reduced mathematical model of the thermal behavior of integrated power electronics module (IPEM) is discussed. The proposed model is an efficient compact thermal model of the IPEM based on lumped thermal capacitance model. The model is validated against a full three dimensional finite volume approach and with experimental data, to make it very efficient and accurate. The reduced electrothermal models are found to be excellent alternative for design methodologies of new generations of IPEMs.",

keywords = "Integrated Power Electronics, Lumped Thermal Capacitance, Reduced Thermal Model",

author = "M. Hern{\'a}ndez-Mora and Gonz{\'a}lez, \{J. E.\} and M. V{\'e}lez-Reyes and Ortiz-Rodr{\'i}guez, \{J. M.\} and Y. Pang and E. Scott",

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AU - Hernández-Mora, M.

AU - González, J. E.

AU - Vélez-Reyes, M.

AU - Ortiz-Rodríguez, J. M.

AU - Pang, Y.

AU - Scott, E.

PY - 2004/12

Y1 - 2004/12

N2 - A reduced mathematical model of the thermal behavior of integrated power electronics module (IPEM) is discussed. The proposed model is an efficient compact thermal model of the IPEM based on lumped thermal capacitance model. The model is validated against a full three dimensional finite volume approach and with experimental data, to make it very efficient and accurate. The reduced electrothermal models are found to be excellent alternative for design methodologies of new generations of IPEMs.

AB - A reduced mathematical model of the thermal behavior of integrated power electronics module (IPEM) is discussed. The proposed model is an efficient compact thermal model of the IPEM based on lumped thermal capacitance model. The model is validated against a full three dimensional finite volume approach and with experimental data, to make it very efficient and accurate. The reduced electrothermal models are found to be excellent alternative for design methodologies of new generations of IPEMs.

KW - Integrated Power Electronics

KW - Lumped Thermal Capacitance

KW - Reduced Thermal Model

UR - https://www.scopus.com/pages/publications/13944271108

U2 - 10.1115/1.1827264

DO - 10.1115/1.1827264

M3 - Article

SN - 1043-7398

VL - 126

SP - 477

EP - 490

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 4

ER -

Dynamic reduced electrothermal model for Integrated Power Electronics Modules (IPEM)

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Keywords

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