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Edge Termination and Peripheral Designs for SiC High-Voltage (HV) Lateral MOSFETs for Power IC Technology

  • SUNY Polytechnic Institute

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Scopus citations

Abstract

This paper focuses on the demonstration of various design architectures (edge termination and peripheral designs) of the lateral HV nMOSFETs fabricated on a 6"N-epi/N+substrate and N-epi/P-epi/N+substrate for the development of HV SiC Power ICs. Along with the cell design, the peripheral design of the lateral HV nMOSFET plays a significant role in attaining an optimum breakdown voltage by effective termination of the electric field. Furthermore, the peripheral design also considerably determines the footprint of lateral HV power MOSFET for power IC integration. The lateral HV MOSFETs reported in this work are one of the best in class with the superior BV-Ron,sp trade-off, and also with high current handling capability.

Original languageEnglish
Title of host publication2022 34th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages213-216
Number of pages4
ISBN (Electronic)9781665422017
DOIs
StatePublished - 2022
Event34th IEEE International Symposium on Power Semiconductor Devices and ICs, ISPSD 2022 - Vancouver, Canada
Duration: May 22 2022May 25 2022

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
Volume2022-May

Conference

Conference34th IEEE International Symposium on Power Semiconductor Devices and ICs, ISPSD 2022
Country/TerritoryCanada
CityVancouver
Period05/22/2205/25/22

Keywords

  • 4H-SiC
  • CMOS
  • Power IC
  • RESURF
  • lateral MOSFET

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