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Effect of fillers on kinetics of epoxy cure

  • SUNY Buffalo

Research output: Contribution to journalArticlepeer-review

143 Scopus citations

Abstract

The effect of fillers on the reaction of liquid epoxy systems cured with m‐phenylenediamine has been studied within the temperature range 70–170°C using a Perkin–Elmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of filler on the kinetics of cure. Mathematical expressions have been devised to describe the curing reaction as a function of time, temperature, and filler content. These kinetic expressions were found to yield results which were in good agreement with the experimental data for the two fillers studied.

Original languageEnglish
Pages (from-to)635-649
Number of pages15
JournalJournal of Applied Polymer Science
Volume24
Issue number3
DOIs
StatePublished - Aug 1 1979

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