Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development

Zhen Mei; D. D.L. Chung

doi:10.1016/S0143-7496(99)00056-1

Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development

Zhen Mei
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

University at Buffalo

SUNY Buffalo

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

A long heating time below the melting temperature (T_m) was found to be detrimental to subsequent polyphenylene sulfide (PPS) adhesive joint development above T_m. This was found to be due to curing reactions below T_m and consequent reduced mass flow response above T_m. A high heating rate (small heating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry.

Original language	English
Pages (from-to)	273-277
Number of pages	5
Journal	International Journal of Adhesion and Adhesives
Volume	20
Issue number	4
DOIs	https://doi.org/10.1016/S0143-7496(99)00056-1
State	Published - 2000

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Cite this

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title = "Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development",

abstract = "A long heating time below the melting temperature (Tm) was found to be detrimental to subsequent polyphenylene sulfide (PPS) adhesive joint development above Tm. This was found to be due to curing reactions below Tm and consequent reduced mass flow response above Tm. A high heating rate (small heating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry.",

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AU - Mei, Zhen

AU - Chung, D. D.L.

PY - 2000

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N2 - A long heating time below the melting temperature (Tm) was found to be detrimental to subsequent polyphenylene sulfide (PPS) adhesive joint development above Tm. This was found to be due to curing reactions below Tm and consequent reduced mass flow response above Tm. A high heating rate (small heating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry.

AB - A long heating time below the melting temperature (Tm) was found to be detrimental to subsequent polyphenylene sulfide (PPS) adhesive joint development above Tm. This was found to be due to curing reactions below Tm and consequent reduced mass flow response above Tm. A high heating rate (small heating time) enhanced the bonding more than a high pressure. The study was conducted by measurement of the contact electrical resistance of the joint, and was supported by calorimetry.

UR - https://www.scopus.com/pages/publications/0033700594

U2 - 10.1016/S0143-7496(99)00056-1

DO - 10.1016/S0143-7496(99)00056-1

M3 - Article

SN - 0143-7496

VL - 20

SP - 273

EP - 277

JO - International Journal of Adhesion and Adhesives

JF - International Journal of Adhesion and Adhesives

IS - 4

ER -

Effect of heating time below the melting temperature on polyphenylene sulfide adhesive joint development

Abstract

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