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Effect of oxygen gas pressure on the kinetics of alumina film growth during the oxidation of Al(111) at room temperature

  • State University of New York Binghamton University
  • Brookhaven National Laboratory

Research output: Contribution to journalArticlepeer-review

61 Scopus citations

Abstract

We have studied the effect of oxygen pressure on the self-limiting oxidation of an Al(111) surface at room temperature for oxygen pressures from 1×10-8 to 5 Torr. Using x-ray photoelectron spectroscopy measurements, we monitor the oxidation kinetics and the oxide film thickness for different oxidation times and pressures. After a rapid initial growth stage, the oxide film reaches a saturated thickness, which depends on the oxygen pressure. The kinetic potential, oxide growth rate, oxide film limiting thickness, and the density of oxygen anions on the oxide surface are determined by the measured oxidation kinetics. These quantities show a Langmuir isotherm dependence on the oxygen gas pressure.

Original languageEnglish
Article number125445
JournalPhysical Review B - Condensed Matter and Materials Physics
Volume84
Issue number12
DOIs
StatePublished - Sep 29 2011

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