Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

Ira R. Holub; James M. Pitarresi; Timothy J. Singler

Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

Binghamton University

State University of New York Binghamton University

Research output: Contribution to conference › Paper › peer-review

9 Scopus citations

Abstract

A general computational approach to determine the effect of solder joint shape on the fatigue life is presented. Using the integrated matrix creep failure metric, a number of cases are considered wherein the solder volume, standoff height, or both, are varied and the joint life computed. Both volumetric and interface averaging of the matrix creep are considered. For non-mask defined pads, the greater the solder volume, the higher the life; for mask defined pads, the reverse trend was observed.

Original language	English
Pages	187-191
Number of pages	5
State	Published - 1996
Event	Proceedings of the 1996 5th Intersociety Conference on Thermal Phenomena in Electronic Systems - Orlando, FL, USA Duration: May 29 1996 → Jun 1 1996

Conference

Conference	Proceedings of the 1996 5th Intersociety Conference on Thermal Phenomena in Electronic Systems
City	Orlando, FL, USA
Period	05/29/96 → 06/1/96

Cite this

@conference{90bd84b393cb4759b104d6436142e157,

title = "Effect of solder joint geometry on the predicted fatigue life of BGA solder joints",

abstract = "A general computational approach to determine the effect of solder joint shape on the fatigue life is presented. Using the integrated matrix creep failure metric, a number of cases are considered wherein the solder volume, standoff height, or both, are varied and the joint life computed. Both volumetric and interface averaging of the matrix creep are considered. For non-mask defined pads, the greater the solder volume, the higher the life; for mask defined pads, the reverse trend was observed.",

author = "Holub, \{Ira R.\} and Pitarresi, \{James M.\} and Singler, \{Timothy J.\}",

year = "1996",

language = "English",

pages = "187--191",

note = "Proceedings of the 1996 5th Intersociety Conference on Thermal Phenomena in Electronic Systems ; Conference date: 29-05-1996 Through 01-06-1996",

}

TY - CONF

T1 - Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

AU - Holub, Ira R.

AU - Pitarresi, James M.

AU - Singler, Timothy J.

PY - 1996

Y1 - 1996

N2 - A general computational approach to determine the effect of solder joint shape on the fatigue life is presented. Using the integrated matrix creep failure metric, a number of cases are considered wherein the solder volume, standoff height, or both, are varied and the joint life computed. Both volumetric and interface averaging of the matrix creep are considered. For non-mask defined pads, the greater the solder volume, the higher the life; for mask defined pads, the reverse trend was observed.

AB - A general computational approach to determine the effect of solder joint shape on the fatigue life is presented. Using the integrated matrix creep failure metric, a number of cases are considered wherein the solder volume, standoff height, or both, are varied and the joint life computed. Both volumetric and interface averaging of the matrix creep are considered. For non-mask defined pads, the greater the solder volume, the higher the life; for mask defined pads, the reverse trend was observed.

UR - https://www.scopus.com/pages/publications/0029696440

M3 - Paper

SP - 187

EP - 191

T2 - Proceedings of the 1996 5th Intersociety Conference on Thermal Phenomena in Electronic Systems

Y2 - 29 May 1996 through 1 June 1996

ER -

Effect of solder joint geometry on the predicted fatigue life of BGA solder joints

Abstract

Conference

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