Effective diffusivity of lead free solder alloys

Shidong Li; Cemal Basaran

doi:10.1016/j.commatsci.2009.06.015

Effective diffusivity of lead free solder alloys

Shidong Li
, Cemal Basaran

Department of Civil, Structural & Environmental Engineering

University at Buffalo

SUNY Buffalo

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn-4.0Ag-0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.

Original language	English
Pages (from-to)	71-78
Number of pages	8
Journal	Computational Materials Science
Volume	47
Issue number	1
DOIs	https://doi.org/10.1016/j.commatsci.2009.06.015
State	Published - Nov 2009

Keywords

Effective diffusivity
Lead free solder alloys
Monte Carlo
Multi-scale modeling

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10.1016/j.commatsci.2009.06.015

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@article{7f1b2e1d1afb4f6a9fa2de2a0965f35d,

title = "Effective diffusivity of lead free solder alloys",

abstract = "A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn-4.0Ag-0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.",

keywords = "Effective diffusivity, Lead free solder alloys, Monte Carlo, Multi-scale modeling",

author = "Shidong Li and Cemal Basaran",

year = "2009",

month = nov,

doi = "10.1016/j.commatsci.2009.06.015",

language = "English",

volume = "47",

pages = "71--78",

journal = "Computational Materials Science",

issn = "0927-0256",

publisher = "Elsevier B.V.",

number = "1",

}

TY - JOUR

T1 - Effective diffusivity of lead free solder alloys

AU - Li, Shidong

AU - Basaran, Cemal

PY - 2009/11

Y1 - 2009/11

N2 - A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn-4.0Ag-0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.

AB - A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn-4.0Ag-0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.

KW - Effective diffusivity

KW - Lead free solder alloys

KW - Monte Carlo

KW - Multi-scale modeling

UR - https://www.scopus.com/pages/publications/70350572778

U2 - 10.1016/j.commatsci.2009.06.015

DO - 10.1016/j.commatsci.2009.06.015

M3 - Article

SN - 0927-0256

VL - 47

SP - 71

EP - 78

JO - Computational Materials Science

JF - Computational Materials Science

IS - 1

ER -

Effective diffusivity of lead free solder alloys

Abstract

Keywords

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