Efficient electroless nickel plating from highly active Ni-B nanoparticles for electric circuit patterns on Al2O3 ceramics

Teng Zhai; Xihong Lu; Guofeng Cui; Gang Wu; Junxiong Qu; Yexiang Tong

doi:10.1039/c3tc31048e

Efficient electroless nickel plating from highly active Ni-B nanoparticles for electric circuit patterns on Al₂O₃ ceramics

Teng Zhai
, Xihong Lu
, Guofeng Cui
, Gang Wu
, Junxiong Qu
, Yexiang Tong

Department of Chemical and Biological Engineering

University at Buffalo

Sun Yat-Sen University

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Herein, we report novel and highly-active Ni-B nanoparticles as a precursor for electroless nickel deposition and demonstrate their implementation as high-performance electric circuits on the CCPCB surface.

Original language	English
Pages (from-to)	5149-5152
Number of pages	4
Journal	Journal of Materials Chemistry C
Volume	1
Issue number	33
DOIs	https://doi.org/10.1039/c3tc31048e
State	Published - Sep 7 2013

Access to Document

10.1039/c3tc31048e

Cite this

@article{edab4d9185f94e45acbfb3dd047f17a4,

title = "Efficient electroless nickel plating from highly active Ni-B nanoparticles for electric circuit patterns on Al2O3 ceramics",

abstract = "Herein, we report novel and highly-active Ni-B nanoparticles as a precursor for electroless nickel deposition and demonstrate their implementation as high-performance electric circuits on the CCPCB surface.",

author = "Teng Zhai and Xihong Lu and Guofeng Cui and Gang Wu and Junxiong Qu and Yexiang Tong",

year = "2013",

month = sep,

day = "7",

doi = "10.1039/c3tc31048e",

language = "English",

volume = "1",

pages = "5149--5152",

journal = "Journal of Materials Chemistry C",

issn = "2050-7534",

number = "33",

}

TY - JOUR

T1 - Efficient electroless nickel plating from highly active Ni-B nanoparticles for electric circuit patterns on Al2O3 ceramics

AU - Zhai, Teng

AU - Lu, Xihong

AU - Cui, Guofeng

AU - Wu, Gang

AU - Qu, Junxiong

AU - Tong, Yexiang

PY - 2013/9/7

Y1 - 2013/9/7

N2 - Herein, we report novel and highly-active Ni-B nanoparticles as a precursor for electroless nickel deposition and demonstrate their implementation as high-performance electric circuits on the CCPCB surface.

AB - Herein, we report novel and highly-active Ni-B nanoparticles as a precursor for electroless nickel deposition and demonstrate their implementation as high-performance electric circuits on the CCPCB surface.

UR - https://www.scopus.com/pages/publications/84881399538

U2 - 10.1039/c3tc31048e

DO - 10.1039/c3tc31048e

M3 - Article

SN - 2050-7534

VL - 1

SP - 5149

EP - 5152

JO - Journal of Materials Chemistry C

JF - Journal of Materials Chemistry C

IS - 33

ER -

Efficient electroless nickel plating from highly active Ni-B nanoparticles for electric circuit patterns on Al₂O₃ ceramics

Abstract

Access to Document

Other files and links

Fingerprint

Cite this