Abstract
Properties of ultrathin HfAlO gate dielectrics on sulfur-passivated p -GaAs were investigated using capacitance-voltage and current-voltage measurement techniques and angle-resolved x-ray photoelectron spectroscopy. By optimizing the individual layer thickness of atomic-layer deposited Al2 O 3 and HfO2 and the postdeposition anneal (PDA) conditions, a low equivalent oxide thickness of 1.6 nm, low gate leakage of 2.6× 10-3 A/ cm2 at Vg = Vfb -1 V, and excellent frequency dispersion characteristics were obtained. No interfacial As-O bonding and only a small amount of Ga-O bonding were detected after PDA at 500 °C. These results reveal a good quality dielectric interface on GaAs without an additional interface passivation layer.
| Original language | English |
|---|---|
| Article number | 193504 |
| Journal | Applied Physics Letters |
| Volume | 93 |
| Issue number | 19 |
| DOIs | |
| State | Published - 2008 |
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