Electroless deposition of copper and silver on niobium surfaces

S. S. Djokic; L. Nolan; K. Cadien; T. Thundat

doi:10.1149/2.007303eel

Electroless deposition of copper and silver on niobium surfaces

S. S. Djokic
, L. Nolan
, K. Cadien
, T. Thundat

Department of Chemical and Biological Engineering

University at Buffalo

Elchem Consulting Ltd.
University of Alberta

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Deposition of copper or silver onto niobium surfaces is possible to achieve at elevated temperatures (above 80C) from strong alkaline solutions containing Cu(II) or Ag(I) ions at pH higher than 12. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reaction.

Original language	English
Pages (from-to)	D16-D18
Journal	ECS Electrochemistry Letters
Volume	2
Issue number	3
DOIs	https://doi.org/10.1149/2.007303eel
State	Published - 2013

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10.1149/2.007303eel

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title = "Electroless deposition of copper and silver on niobium surfaces",

abstract = "Deposition of copper or silver onto niobium surfaces is possible to achieve at elevated temperatures (above 80C) from strong alkaline solutions containing Cu(II) or Ag(I) ions at pH higher than 12. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reaction.",

author = "Djokic, \{S. S.\} and L. Nolan and K. Cadien and T. Thundat",

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T1 - Electroless deposition of copper and silver on niobium surfaces

AU - Djokic, S. S.

AU - Nolan, L.

AU - Cadien, K.

AU - Thundat, T.

PY - 2013

Y1 - 2013

N2 - Deposition of copper or silver onto niobium surfaces is possible to achieve at elevated temperatures (above 80C) from strong alkaline solutions containing Cu(II) or Ag(I) ions at pH higher than 12. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reaction.

AB - Deposition of copper or silver onto niobium surfaces is possible to achieve at elevated temperatures (above 80C) from strong alkaline solutions containing Cu(II) or Ag(I) ions at pH higher than 12. This deposition does not require a reducing agent, i.e. process proceeds via galvanic displacement reaction.

UR - https://www.scopus.com/pages/publications/84880416803

U2 - 10.1149/2.007303eel

DO - 10.1149/2.007303eel

M3 - Article

SN - 2162-8726

VL - 2

SP - D16-D18

JO - ECS Electrochemistry Letters

JF - ECS Electrochemistry Letters

IS - 3

ER -

Electroless deposition of copper and silver on niobium surfaces

Abstract

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