Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Liqun Zhu; Imin Kao

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Liqun Zhu
, Imin Kao

Mechanical Engineering

Stony Brook University

Stony Brook University

Research output: Contribution to conference › Paper › peer-review

1 Scopus citations

Abstract

An improved elasto-hydrodynamic (EHD) model of wiresaw slicing process is summarized in this paper which incorporates the equation of equilibrium for the motion of the wire. Parametric studies are conducted, which encompass different cases in the wiresaw slicing process. Based on the results, we examine the effects of wire bow angle on the EHD properties and the slicing mechanism of wiresaw process. The simulation results provide insights to the wiresaw slicing mechanism, and suggest ways to facilitate the experimental study for industry wiresaw slicing.

Original language	English
Pages	123-128
Number of pages	6
State	Published - 2001
Event	2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: Nov 11 2001 → Nov 16 2001

Conference

Conference	2001 ASME International Mechanical Engineering Congress and Exposition
Country/Territory	United States
City	New York, NY
Period	11/11/01 → 11/16/01

Cite this

@conference{63280df32e884d86a6d30e9d7372182d,

title = "Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw",

abstract = "An improved elasto-hydrodynamic (EHD) model of wiresaw slicing process is summarized in this paper which incorporates the equation of equilibrium for the motion of the wire. Parametric studies are conducted, which encompass different cases in the wiresaw slicing process. Based on the results, we examine the effects of wire bow angle on the EHD properties and the slicing mechanism of wiresaw process. The simulation results provide insights to the wiresaw slicing mechanism, and suggest ways to facilitate the experimental study for industry wiresaw slicing.",

author = "Liqun Zhu and Imin Kao",

year = "2001",

language = "English",

pages = "123--128",

note = "2001 ASME International Mechanical Engineering Congress and Exposition ; Conference date: 11-11-2001 Through 16-11-2001",

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TY - CONF

T1 - Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

AU - Zhu, Liqun

AU - Kao, Imin

PY - 2001

Y1 - 2001

N2 - An improved elasto-hydrodynamic (EHD) model of wiresaw slicing process is summarized in this paper which incorporates the equation of equilibrium for the motion of the wire. Parametric studies are conducted, which encompass different cases in the wiresaw slicing process. Based on the results, we examine the effects of wire bow angle on the EHD properties and the slicing mechanism of wiresaw process. The simulation results provide insights to the wiresaw slicing mechanism, and suggest ways to facilitate the experimental study for industry wiresaw slicing.

AB - An improved elasto-hydrodynamic (EHD) model of wiresaw slicing process is summarized in this paper which incorporates the equation of equilibrium for the motion of the wire. Parametric studies are conducted, which encompass different cases in the wiresaw slicing process. Based on the results, we examine the effects of wire bow angle on the EHD properties and the slicing mechanism of wiresaw process. The simulation results provide insights to the wiresaw slicing mechanism, and suggest ways to facilitate the experimental study for industry wiresaw slicing.

UR - https://www.scopus.com/pages/publications/0347603251

M3 - Paper

SP - 123

EP - 128

T2 - 2001 ASME International Mechanical Engineering Congress and Exposition

Y2 - 11 November 2001 through 16 November 2001

ER -

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Abstract

Conference

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