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EUV resists based on Tin-Oxo clusters

  • Brian Cardineau
  • , Ryan Del Re
  • , Hashim Al-Mashat
  • , Miles Marnell
  • , Michaela Vockenhuber
  • , Yasin Ekinci
  • , Chandra Sarma
  • , Mark Neisser
  • , Daniel A. Freedman
  • , Robert L. Brainard
  • SUNY Polytechnic Institute
  • SUNY New Paltz
  • Paul Scherrer Institute
  • SEMATECH

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

70 Scopus citations

Abstract

We have studied the photolysis of tin clusters of the type [(RSn)12O14(OH)6] X2 using extreme ultraviolet (EUV, 13.5 nm) light, and developed these clusters into novel high-resolution photoresists. A thin film of [(BuSn)12O14(OH)6][p-toluenesulfonate]2 (1) was prepared by spin coating a solution of (1) in 2-butanone onto a silicon wafer. Exposure to EUV light caused the compound (1) to be converted into a substance that was markedly less soluble in aqueous isopropanol. To optimize the EUV lithographic performance of resists using tin-oxo clusters, and to gain insight into the mechanism of their photochemical reactions, we prepared several compounds based on [(RSn)12O14(OH)6] X2. The sensitivity of tin-oxide films to EUV light were studied as a function of variations in the structure of the counter-anions (X, primarily carboxylates) and organic ligands bound to tin (R). Correlations were sought between the EUV sensitivity of these complexes vs. the strength of the carbon-carboxylate bonds in the counteranions and vs. the strength of the carbon-tin bonds. No correlation was observed between the strength of the carboncarboxylate bonds in the counter-anions (X) and the EUV photosensitivity. However, the EUV sensitivity of the tinoxide films appears to be well-correlated with the strength of the carbon-tin bonds. We hypothesize this correlation indicates a mechanism of carbon-tin bond homolysis during exposure. Using these tin clusters, 18-nm lines were printed showcasing the high resolution capabilities of these materials as photoresists for EUV lithography.

Original languageEnglish
Title of host publicationAdvances in Patterning Materials and Processes XXXI
PublisherSPIE
ISBN (Print)9780819499745
DOIs
StatePublished - 2014
EventAdvances in Patterning Materials and Processes XXXI - San Jose, CA, United States
Duration: Feb 24 2014Feb 27 2014

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9051

Conference

ConferenceAdvances in Patterning Materials and Processes XXXI
Country/TerritoryUnited States
CitySan Jose, CA
Period02/24/1402/27/14

Keywords

  • Cluster
  • EUV
  • Organometallic
  • Photolysis
  • Photoresist
  • Tin

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