@inproceedings{16f89264c5bb41be9950654b1dd7b4e6,
title = "Experimental characterization of material degradation of solder joint under fatigue loading",
abstract = "Thermal fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally quantify the material degradation of solder joint in electronic BGA package under thermal fatigue loading. Elastic modulus degradation under thermal cycling, which is considered as a physically detectable quantity of material degradation, was measured by nano-indenter. It was compared with tendency of inelastic strain accumulation of solder joint in BGA package under thermal cycling, which was measured by Moire interferometry. Fatigue damage evolution of solder joint with traditional load-drop criterion was also investigated by strain-stress hysteresis loops from strain-controlled cyclic shear testing of thin layer solder joint. Load-drop tendency from isothermal shear testing was compared with elastic modulus degradation of solder joint under thermal cycling. Following conventional Coffin-Manson approach, S-N curve was obtained from isothermal fatigue testing with load-drop criterion. In this study, thermal fatigue life prediction of solder joint in electronic BGA package was conventionally made based on this Coffin-Mason S-N curve and measured inelastic strain accumulation of solder joint under thermal cycling, and compared with measured elastic modulus degradation tendency. The experimental investigation results will be used for further thermal fatigue damage evolution modeling using thermodynamic continuum damage mechanics theory. The primary contribution of this project is to observe material degradation of BGA solder joints at actual micron scale under thermal fatigue loading, and compare the results with isothermal fatigue response of solder alloys. All previous research on the subject has been done on bulk scale specimens.",
keywords = "Electronic packaging thermal management, Fatigue, Interferometry, Isothermal processes, Joining materials, Soldering, Strain measurement, Testing, Thermal degradation, Thermal loading",
author = "Hong Tang and C. Basaran and Terry Dishongh",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",
year = "2002",
doi = "10.1109/ITHERM.2002.1012550",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "896--902",
editor = "Sammakia, \{Bahgat G.\} and Joshi, \{Yogendra K.\} and Ganesh Subbarayan and Amon, \{Cristina H.\} and Koneru Ramakrishna and Sathe, \{Sanjeev B.\}",
booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",
address = "United States",
}