Experimental study of failure mechanisms in particle filled acrylic composites

C. Basaran; S. Nie; C. S. Hutchins

doi:10.1109/ITHERM.2002.1012563

Experimental study of failure mechanisms in particle filled acrylic composites

C. Basaran
, S. Nie
, C. S. Hutchins

Department of Civil, Structural & Environmental Engineering

University at Buffalo

SUNY Buffalo
DuPont

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.

Original language	English
Title of host publication	ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Editors	Bahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
Publisher	IEEE Computer Society
Pages	979-986
Number of pages	8
ISBN (Electronic)	0780371526
DOIs	https://doi.org/10.1109/ITHERM.2002.1012563
State	Published - 2002
Event	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States Duration: May 30 2002 → Jun 1 2002

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume	2002-January

Conference

Conference	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/Territory	United States
City	San Diego
Period	05/30/02 → 06/1/02

Keywords

Compressive stress
Failure analysis
Fatigue
Material properties
Materials testing
Solids
Surface cracks
Temperature
Tensile stress
Thermal stresses

Access to Document

10.1109/ITHERM.2002.1012563

Cite this

Basaran, C., Nie, S., & Hutchins, C. S. (2002). Experimental study of failure mechanisms in particle filled acrylic composites. In B. G. Sammakia, Y. K. Joshi, G. Subbarayan, C. H. Amon, K. Ramakrishna, & S. B. Sathe (Eds.), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (pp. 979-986). Article 1012563 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012563

Basaran, C. ; Nie, S. ; Hutchins, C. S. / Experimental study of failure mechanisms in particle filled acrylic composites. ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. editor / Bahgat G. Sammakia ; Yogendra K. Joshi ; Ganesh Subbarayan ; Cristina H. Amon ; Koneru Ramakrishna ; Sanjeev B. Sathe. IEEE Computer Society, 2002. pp. 979-986 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

@inproceedings{55561c9acb1e4fffa47e9d337d247680,

title = "Experimental study of failure mechanisms in particle filled acrylic composites",

abstract = "Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.",

keywords = "Compressive stress, Failure analysis, Fatigue, Material properties, Materials testing, Solids, Surface cracks, Temperature, Tensile stress, Thermal stresses",

author = "C. Basaran and S. Nie and Hutchins, \{C. S.\}",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",

year = "2002",

doi = "10.1109/ITHERM.2002.1012563",

language = "English",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

publisher = "IEEE Computer Society",

pages = "979--986",

editor = "Sammakia, \{Bahgat G.\} and Joshi, \{Yogendra K.\} and Ganesh Subbarayan and Amon, \{Cristina H.\} and Koneru Ramakrishna and Sathe, \{Sanjeev B.\}",

booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",

address = "United States",

}

Basaran, C, Nie, S & Hutchins, CS 2002, Experimental study of failure mechanisms in particle filled acrylic composites. in BG Sammakia, YK Joshi, G Subbarayan, CH Amon, K Ramakrishna & SB Sathe (eds), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems., 1012563, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2002-January, IEEE Computer Society, pp. 979-986, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, San Diego, United States, 05/30/02. https://doi.org/10.1109/ITHERM.2002.1012563

Experimental study of failure mechanisms in particle filled acrylic composites. / Basaran, C.; Nie, S.; Hutchins, C. S.
ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. ed. / Bahgat G. Sammakia; Yogendra K. Joshi; Ganesh Subbarayan; Cristina H. Amon; Koneru Ramakrishna; Sanjeev B. Sathe. IEEE Computer Society, 2002. p. 979-986 1012563 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Experimental study of failure mechanisms in particle filled acrylic composites

AU - Basaran, C.

AU - Nie, S.

AU - Hutchins, C. S.

PY - 2002

Y1 - 2002

N2 - Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.

AB - Particle filled solid surface composites are used to fabricate kitchen countertops and sinks which may be subjected to severe temperature variations, giving rise to high thermal stresses. These stresses may lead to failure by cracking in regions subjected to large temperature variation. An aim of this paper is to investigate mechanisms of failure in solid surface materials using in situ observations during tensile, compressive and fatigue loading and to define test configurations that give meaningful measurements of material properties. Experiments show that the failure in tension occurs in several stages. In flexural loading the failure process is more complex. Consequently, flexural testing should not be used as a substitute for the measurement of ultimate tensile strength in a particle filled solid surface composite. The application of conventional damage mechanics to describe the failure of test specimens is also discussed.

KW - Compressive stress

KW - Failure analysis

KW - Fatigue

KW - Material properties

KW - Materials testing

KW - Solids

KW - Surface cracks

KW - Temperature

KW - Tensile stress

KW - Thermal stresses

UR - https://www.scopus.com/pages/publications/84950161610

U2 - 10.1109/ITHERM.2002.1012563

DO - 10.1109/ITHERM.2002.1012563

M3 - Conference contribution

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 979

EP - 986

BT - ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

A2 - Sammakia, Bahgat G.

A2 - Joshi, Yogendra K.

A2 - Subbarayan, Ganesh

A2 - Amon, Cristina H.

A2 - Ramakrishna, Koneru

A2 - Sathe, Sanjeev B.

PB - IEEE Computer Society

T2 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002

Y2 - 30 May 2002 through 1 June 2002

ER -

Basaran C, Nie S, Hutchins CS. Experimental study of failure mechanisms in particle filled acrylic composites. In Sammakia BG, Joshi YK, Subbarayan G, Amon CH, Ramakrishna K, Sathe SB, editors, ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. IEEE Computer Society. 2002. p. 979-986. 1012563. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2002.1012563

Experimental study of failure mechanisms in particle filled acrylic composites

Abstract

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Keywords

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